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参数资料
| 型号： | MAX3750CEE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | IC PORT BYPASS 2.125GBPS 16-QSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 数据传输 |
| 电源电压： | 3 V ~ 3.6 V |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-QSOP |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
MAX3750/MAX3751
+3.3V, 2.125Gbps/1.0625Gbps
Fibre Channel Port Bypass ICs
4
_______________________________________________________________________________________
_________________Circuit Description
A simplified block diagram of the single port bypass is
shown in Figure 1. IN+ and IN- drive an input buffer
(INBUFF) with 150 of internal differential input termi-
nation. INBUFF drives an output buffer (LOBUFF) and
an input to a multiplexer (MUX).
A low TTL input at SEL selects the signal path of
INBUFF through MUX to the output buffer (OUTBUFF).
When SEL has a high TTL logic level present the signal
path is into LIBUFF, through MUX, to OUTBUFF.
Low-Frequency Cutoff
The low-frequency cutoff is determined by the input
resistance and the coupling capacitor as illustrated by
the following equation:
fC = 1 / (2πRC)
In a typical system where R = 150 and C = 100nF,
resulting in fC = 10kHz.
Layout Techniques
The MAX3750/MAX3751 are high-frequency products.
The performance of the circuit is largely dependent
upon layout of the circuit board. Use a multilayer circuit
board with dedicated ground and VCC planes. Power
supplies should be capacitively bypassed to the
ground plane with surface-mount capacitors placed
near the power-supply pins.
SEL
NOTE: SEE INTERNAL INPUT/OUTPUT SCHEMATICS FOR DETAILED TERMINATIONS (FIGURES 2–5).
INBUFF
LOBUFF
LIBUFF
IN+
IN-
MUX
D0
Q
SEL
TTLIN
D1
OUTBUFF
OUT+
OUT-
VCC
GND
LOUT+
LOUT-
LIN+
LIN-
MAX3750
MAX3751
Figure 1. MAX3750/MAX3751 Block Diagram
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3750CEE-TG075 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3750EVKIT | 功能描述:维光缆分布式数据接口 - FDDI Evaluation Kit for the MAX3750 MAX3751 RoHS:否 封装:Tube 制造商:Maxim Integrated |
| MAX3751CEE | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3752CCM | 功能描述:通信集成电路 - 若干 RoHS:否 制造商:Maxim Integrated 类型:Transport Devices 封装 / 箱体:TECSBGA-256 数据速率:100 Mbps 电源电压-最大:1.89 V, 3.465 V 电源电压-最小:1.71 V, 3.135 V 电源电流:50 mA, 225 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装:Tube |
| MAX3752CCM+ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
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