参数资料
型号: MAX3869EHJ+T
厂商: Maxim Integrated
文件页数: 11/15页
文件大小: 0K
描述: IC LASER DRIVR 2CHAN 5.5V 32TQFP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 激光二极管驱动器(光纤)
数据速率: 2.5Gbps
通道数: 2
电源电压: 3.14 V ~ 5.5 V
电流 - 电源: 64mA
电流 - 调制: 60mA
电流 - 偏置: 100mA
工作温度: -40°C ~ 85°C
封装/外壳: 32-TQFP 裸露焊盘
供应商设备封装: 32-TQFP-EP(5x5)
包装: 带卷 (TR)
安装类型: 表面贴装
+3.3V, 2.5Gbps SDH/SONET Laser Driver
with Current Monitors and APC
Determine R BIASMAX
Calculate the maximum threshold current (I TH(MAX) ) at
T A = +85°C and end of life. Assuming I TH(MAX) =
50mA, the maximum bias current should be:
I BIASMAX = I TH(MAX) + I MOD /2
In this example, I BIASMAX = 68.1mA. The I BIASMAX vs.
R BIASMAX graph in the Typical Operating Characteristics
shows that R BIASMAX should be 3.2k ? .
Modulation Currents Exceeding 60mA
With a +5V power supply, the headroom voltage for the
MAX3869 is significantly improved. In this case, it is
possible to achieve a modulation current of more than
60mA with AC-coupling, if the junction temperature is
kept below 150°C. The MAX3869 can also be DC-cou-
pled to a laser diode when operating with a +5V sup-
ply; the voltage at OUT+ should be ≥ 2.0V for proper
operation.
Wire Bonding Die
For high current density and reliable operation, the
MAX3869 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils (100μm) square, and die thickness is 12
mils (300μm) square.
Layout Considerations
To minimize inductance, keep the connections between
the MAX3869 output pins and LD as close as possible.
Optimize the laser diode performance by placing a
bypass capacitor as close as possible to the laser
anode. Use good high-frequency layout techniques
and multilayer boards with uninterrupted ground planes
to minimize EMI and crosstalk.
Laser Safety and IEC 825
Using the MAX3869 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Each customer must determine the level
of fault tolerance required by their application, recogniz-
ing that Maxim products are not designed or authorized
for use as components in systems intended for surgical
implant into the body, for applications intended to sup-
port or sustain life, or for any other application where the
failure of a Maxim product could create a situation
where personal injury or death may occur.
Chip Information
TRANSISTOR COUNT: 1561
SUBSTRATE CONNECTED TO GND
______________________________________________________________________________________
11
相关PDF资料
PDF描述
GRM155R71H561KA01D CAP CER 560PF 50V 10% X7R 0402
S1AB-13-F DIODE GPP 1A 50V SMB
CAT28C256GI-15T IC EEPROM 256KBIT 150NS 32PLCC
CAT28C256GI15 IC EEPROM 256KBIT 150NS 32PLCC
ESA40DTKD CONN EDGECARD 80POS DIP .125 SLD
相关代理商/技术参数
参数描述
MAX3869ETJ+ 功能描述:激光驱动器 3.3V 2.5Gbps SDH/ SONET Laser Driver RoHS:否 制造商:Micrel 数据速率:4.25 Gbps 工作电源电压:3 V to 3.6 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:QFN-16 封装:Tube
MAX3869ETJ+D 制造商:Maxim Integrated Products 功能描述:- Rail/Tube
MAX3869ETJ+T 功能描述:激光驱动器 3.3V 2.5Gbps SDH/ SONET Laser Driver RoHS:否 制造商:Micrel 数据速率:4.25 Gbps 工作电源电压:3 V to 3.6 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:QFN-16 封装:Tube
MAX3869EVKIT 功能描述:激光驱动器 Evaluation Kit for the MAX3869 RoHS:否 制造商:Micrel 数据速率:4.25 Gbps 工作电源电压:3 V to 3.6 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:QFN-16 封装:Tube
MAX3872AETJ+ 功能描述:计时器和支持产品 Multirate Clock and Data Recovery with Limiting Amplifier RoHS:否 制造商:Micrel 类型:Standard 封装 / 箱体:SOT-23 内部定时器数量:1 电源电压-最大:18 V 电源电压-最小:2.7 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装:Reel