参数资料
型号: MAX4000EBL+T
厂商: Maxim Integrated
文件页数: 16/19页
文件大小: 0K
描述: IC CTLR RF DET 2.5GHZ 45DB 8UCSP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
频率: 2.5GHz
增益: 10dB
RF 型: 手机,GSM,GPRS
电源电压: 2.7 V ~ 5.5 V
电流 - 电源: 5.9mA
封装/外壳: 8-UFBGA,FCBGA
包装: 带卷 (TR)
2.5GHz 45dB RF-Detecting Controllers
Waveform Considerations
The MAX4000/MAX4001/MAX4002 family of log amps
respond to voltage, not power, even though input levels
are specified in dBm. It is important to realize that input
signals with identical RMS power but unique waveforms
results in different log amp outputs.
Differing signal waveforms result in either an upward or
downward shift in the logarithmic intercept. However,
the logarithmic slope remains the same.
Layout Considerations
As with any RF circuit, the layout of the MAX4000/
MAX4001/MAX4002 circuits affects performance. Use a
short 50 Ω line at the input with multiple ground vias
along the length of the line. The input capacitor and
resistor should both be placed as close to the IC as
possible. V CC should be bypassed as close as possi-
ble to the IC with multiple vias connecting the capacitor
to the ground plane. It is recommended that good RF
components be chosen for the desired operating fre-
quency range. Electrically isolate RF input from
other pins (especially SET) to maximize perfor-
mance at high frequencies (especially at the high
power levels of the MAX4002).
Pin Configurations
TOP VIEW
UCSP Reliability
The UCSP represents a unique package that greatly
reduces board space compared to other packages.
UCSP reliability is integrally linked to the user’s assem-
bly methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP. This form factor may not
perform equally to a packaged product through tradi-
tional mechanical reliability tests. Performance through
operating life test and moisture resistance remains
uncompromised as it is primarily determined by the
wafer fabrication process. Mechanical stress perform-
ance is a greater consideration for a UCSP. UCSP sol-
der joint contact integrity must be considered since the
package is attached through direct solder contact to
the user’s PCB. Testing done to characterize the UCSP
reliability performance shows that it is capable of per-
forming reliably through environmental stresses.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website, www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 358
PROCESS: Bipolar
RFIN
1
8
V CC
SHDN
SET
CLPF
2
3
4
MAX4000
MAX4001
MAX4002
7
6
5
OUT
N.C.
GND
TOP VIEW
μ MAX
(BUMPS ON BOTTOM)
A
1
RFIN
2
SHDN
3
SET
MAX4000
B
V CC
MAX4001
CLPF
MAX4002
C
V CC
OUT
GND
UCSP
16
______________________________________________________________________________________
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