参数资料
型号: MAX4162ESA+
厂商: Maxim Integrated Products
文件页数: 3/13页
文件大小: 0K
描述: IC OPAMP MICROPWR SNGL R-R 8SOIC
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 100
放大器类型: 通用
电路数: 1
输出类型: 满摆幅
转换速率: 0.115 V/µs
增益带宽积: 200kHz
电流 - 输入偏压: 1pA
电压 - 输入偏移: 500µV
电流 - 电源: 25µA
电流 - 输出 / 通道: 15mA
电压 - 电源,单路/双路(±): 2.7 V ~ 10 V,±1.35 V ~ 5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
产品目录页面: 1388 (CN2011-ZH PDF)
MAX4162/MAX4163/MAX4164
UCSP, Micropower, Single-Supply, 10V,
Rail-to-Rail I/O Op Amps
______________________________________________________________________________________
11
1) The on-board charge pumps generate a small
amount of 700kHz switching noise at the op amp’s
output. The amplitude of this noise is typically
100VP-P. The noise is not referred to the input, and
is independent of amplifier gain. The charge-pump
switching frequency is well beyond the amplifier’s
200kHz bandwidth, and is therefore unnoticeable in
most applications.
2) The charge pumps typically require up to 20s on
power-up to fully energize the internal supply rails
(Figure 3).
Power Supplies and Layout
The MAX4162/MAX4163/MAX4164 are guaranteed to
operate from a single 2.5V to 10.0V power supply, but
full rail-to-rail operation typically extends below 2V. For
single-supply operation, bypass the power supply with a
1F capacitor in parallel with a 0.1F ceramic capacitor.
If operating from dual supplies, bypass each supply to
ground.
Good layout improves performance by decreasing the
amount of stray capacitance at the op amp’s inputs and
output. To decrease stray capacitance, minimize both
trace and external component lead lengths, and place
external components close to the op amp’s pins.
UCSP Package Consideration
For general UCSP package information and PC layout
considerations, please refer to the Maxim Application
Note (Wafer-Level Ultra-Chip-Board-Scale-Package).
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP. Performance through oper-
ating life test and moisture resistance remains uncom-
promised as it is primarily determined by the
wafer-fabrication process. Mechanical stress perfor-
mance is a greater consideration for a UCSP package.
UCSPs are attached through direct solder contact to
the user’s PC board, foregoing the inherent stress relief
of a packaged product lead frame. Solder joint contact
integrity must be considered.
Table 1 shows the testing done to characterize the
UCSP reliability performance. In conclusion, the UCSP
is capable of performing reliably through environmental
stresses as indicated by the results in the table.
Additional usage data and recommendations are
detailed in the UCSP application note, which can be
found on Maxim’s website at www.maxim-ic.com.
TEST
CONDITIONS
DURATION
NO. OF FAILURES PER
SAMPLE SIZE
Temperature Cycle
-35°C to +85°C, -40°C to +100°C
150 cycles, 900 cycles
0/10, 0/200
Operating Life
TA = +70°C
240h
0/10
Moisture Resistance
-20°C to +60°C, 90% RH
240h
0/10
Low-Temperature Storage
-20°C
240h
0/10
Low-Temperature Operational
-10°C
24h
0/10
Solderability
8h steam age
0/15
ESD
±2000V, Human Body Model
0/5
High-Temperature Operating
Life
TJ = +150°C
168h
0/45
Table 1. Reliability Test Data
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MAX4162ESA+ 功能描述:运算放大器 - 运放 uPower Single Supply Rail-Rail RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比(最小值):63 dB 输入补偿电压:1 mV 输入偏流(最大值):10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel
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