参数资料
型号: MAX4365ETA+T
厂商: Maxim Integrated Products
文件页数: 7/14页
文件大小: 0K
描述: IC AMP AUDIO PWR 1W MONO 8TDFN
标准包装: 2,500
类型: AB 类
输出类型: 1-通道(单声道)
在某负载时最大输出功率 x 通道数量: 1W x 1 @ 8 欧姆
电源电压: 2.7 V ~ 5.5 V
特点: 消除爆音,短路保护和热保护,关闭
安装类型: 表面贴装
供应商设备封装: 8-TDFN-EP(3x3)
封装/外壳: 8-WDFN 裸露焊盘
包装: 带卷 (TR)
MAX4364/MAX4365
1.4W and 1W, Ultra-Small, Audio Power
Amplifiers with Shutdown
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC, OUT_ to GND...................................................-0.3V to +6V
IN+, IN-, BIAS, SHDN to GND....................-0.3V to (VCC + 0.3V)
Output Short Circuit (OUT+ to OUT-) (Note 1)...........Continuous
Continuous Power Dissipation (TA = +70°C)
8-Pin MAX (derate 4.8mW/°C above +70°C) ..............388mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
8-Pin SO (derate 7.8mW/°C above +70°C)...................623mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
ELECTRICAL CHARACTERISTICS—5V
(VCC = 5V, RL = ∞, CBIAS = 1F to GND, VSHDN = VGND, TA = +25°C, unless otherwise noted.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage Range
VCC
Inferred from PSRR test
2.7
5.5
V
MAX4364
7
13
MAX4364, TA = TMIN to TMAX
17
MAX4365
5
8
Supply Current
ICC
(Note 4)
MAX4365, TA = TMIN to TMAX
11
mA
Shutdown Supply Current
ISHDN
VSHDN = VCC
0.01
4
A
TA = +25°C
VCC x
0.7
VIH
TA = -40°C to +85°C
(Note 5)
VCC x
0.7
TA = +25°C
VCC x
0.3
SHDN Threshold
VIL
TA = -40°C to +85°C
(Note 5)
VCC x
0.3
V
Common-Mode Bias Voltage
VBIAS
(Note 6)
VCC/2 -
5%
VCC/2
+ 5%
V
Output Offset Voltage
VOS
IN- = OUT+, IN+ = BIAS (Note 7)
±1
±10
mV
VCC = 2.7V to 5.5V
DC
55
75
217Hz
68
Power-Supply Rejection Ratio
PSRR
VRIPPLE = 200mVP-P,
RL = 8
1kHz
58
dB
MAX4364
1200
1400
Output Power
POUT
RL = 8
, THD+N = 1%,
fIN = 1kHz (Note 8)
MAX4365
800
1000
mW
Note 1: Continuous power dissipation must also be observed.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
MAX
Junction-to-Ambient Thermal Resistance (
θJA)......206.3°C/W
Junction-to-Case Thermal Resistance (
θJC)................42°C/W
TDFN
Junction-to-Ambient Thermal Resistance (
θJA)...........41°C/W
Junction-to-Case Thermal Resistance (
θJC)..................8°C/W
SO
Junction-to-Ambient Thermal Resistance (
θJA)......128.4°C/W
Junction-to-Case Thermal Resistance (
θJC)................36°C/W
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