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| 型号： | MAX44280AXT+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 9/16页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP GP RRIO 50MHZ LN SC70-6 |
| 产品培训模块： | Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 放大器类型： | 通用 |
| 电路数： | 1 |
| 输出类型： | 满摆幅 |
| 转换速率： | 30 V/µs |
| 增益带宽积： | 50MHz |
| 电流 - 输入偏压： | 0.01pA |
| 电压 - 输入偏移： | 10µV |
| 电流 - 电源： | 750µA |
| 电流 - 输出 / 通道： | 85mA |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-TSSOP，SC-88，SOT-363 |
| 供应商设备封装： | SC-70-6 |
| 包装： | 带卷 (TR) |
MAX44280
1.8V, 50MHz, Low-Offset,
Low-Power, Rail-to-Rail I/O Op Amp
2
Maxim Integrated
IN+, IN-, OUT .................................(VSS - 0.3V) to (VDD + 0.3V)
VDD to VSS...............................................................-0.3V to +6V
SHDN.......................................................................-0.3V to +6V
Output to Short-Circuit Ground Duration .............................. 10s
Continuous Input Current into Any Pin............................ Q20mA
Continuous Power Dissipation (TA = +70NC)
SC70 (derate 3.1mW/NC above +70NC) ......................245mW
Thin DFN (Ultra-Thin LGA)
(derate 2.1mW/NC above +70NC) .............................110.2mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
SC70
Junction-to-Ambient Thermal Resistance (BJA) .... 326.5NC/W
Junction-to-Case Thermal Resistance (BJC) .............115NC/W
Thin DFN (Ultra-Thin LGA)
Junction-to-Ambient Thermal Resistance (BJA) ....... 470NC/W
Junction-to-Case Thermal Resistance (BJC) ............ 120NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, VSHDN = VDD, TA = -40NC to +125NC. Typical values are at
TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Input Voltage Range
VIN+ VIN-
Guaranteed by CMRR test
-0.1
VDD
+ 0.1
V
Input Offset Voltage
VOS
TA = +25NC
10
50
F
V
TA = -40°C to +125°C after calibration
100
TA = -40°C to +125°C
500
Input Offset Voltage Drift
VOS - TC
0.8
5
F
V/NC
Input Bias Current (Note 3)
IB
TA = +25NC
0.01
0.5
pA
TA = -40NC to +85NC
10
TA = -40NC to +125NC
100
Input Capacitance
CIN
0.4
pF
Common-Mode Rejection Ratio
CMRR
VCM = -0.1V to (VDD + 0.1V)
75
90
dB
Open-Loop Gain
AOL
0.4V P VOUT P VDD - 0.4V, ROUT = 10kI
100
115
dB
0.4V P VOUT P VDD - 0.4V, ROUT = 600I
91
100
0.4V P VOUT P VDD - 0.4V, ROUT = 32I
80
Output Short-Circuit Current
ISC
To VDD or VSS
85
mA
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