参数资料
| 型号： | MAX4688EBT+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/8页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH SPDT 6UCSP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 开关 |
| 电路： | 1 x SPDT |
| 导通状态电阻： | 2.5 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V |
| 电流 - 电源： | 1µA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WFBGA，CSPBGA |
| 供应商设备封装： | 6-uCSP（1.57x1.16） |
| 包装： | 带卷 (TR) |
MAX4686/MAX4687/MAX4688
2.5
, Low-Voltage, SPST/SPDT
Analog Switches in UCSP Package
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V+ = +2.7V to +3.3V, VIH = +1.4V, VIL = 0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at 3V and TA = +25
°C.)
(Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
All Voltages Referenced to GND
V+, IN .......................................................................-0.3V to +6V
COM, NO, NC (Note1)..................................-0.3V to (V+ + 0.3V)
Continuous Current NO, NC, COM ................................±100mA
Peak Current NO, NC, COM
(pulsed at 1ms, 10% duty cycle) ...............................±200mA
Continuous Power Dissipation (TA = +70°C)
3 x 2 UCSP (derate 10.1mW/°C at +70°C) ..................808mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range ............................-65°C to +150°C
Bump Reflow Temperature .............................................+235°C
PARAMETER
SYMBOL
CONDITIONS
TA
MIN
TYP
MAX
UNITS
ANALOG SWITCH
Analog Signal Range
VCOM, VNO,
VNC
TMIN to
TMAX
0V+
V
+25°C
1.5
2.5
On-Resistance
RON
V+ = 2.7V, VNC = 0 to V+,
ICOM = 10mA
TMIN to
TMAX
3.5
+25°C
0.3
0.4
On-Resistance Match
Between Channels
(MAX4688 only)
(Note 5)
RON
V+ = 2.7V, VNO or VNC = 1.5V,
ICOM = 10mA
TMIN to
TMAX
0.5
+25°C
0.5
1
On-Resistance Flatness
(Note 6)
RFLAT(ON)
V+ = 2.7V, VNO or VNC = 0 to V+,
ICOM = 10mA
TMIN to
TMAX
1
+25°C
-0.5
±0.01
+0.5
NO, NC Off-Leakage
Current (Note 7)
INO(OFF),
INC(OFF)
V+ = 3.3V; VCOM = 0.3V or 3V;
VNO or VNC = 3V, 0.3V
TMIN to
TMAX
-1
1
nA
+25°C
-0.5
±0.01
0.5
COM Off-Leakage
Current (Note 7)
ICOM_(OFF)
V+ = 3.3V; VCOM = 0.3V or 3V;
VNO or VNC = 3V, 0.3V
TMIN to
TMAX
-1
1
nA
+25°C
-0.5
±0.01
0.5
COM On-Leakage
Current (Note 7)
ICOM_(ON)
V+ = 3.3V; VCOM = 3V or 0.3V;
VNO or VNC = 3V, 0.3V, or floating
TMIN to
TMAX
-1
1
nA
DYNAMIC CHARACTERISTICS
+25°C20
30
Turn-On Time (Note 7)
tON
VNO or VNC = 1.5V, Figure 2
TMIN to
TMAX
35
ns
Note 1: Signals on NO, NC, and COM exceeding V+ are clamped by an internal diode. Limit forward-diode current to maximum cur-
rent rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is requied. Hand or wave soldering is not allowed.
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