MAX4885E
Ultra-Low Capacitance 1:2 VGA
Switch with ±15kV ESD
2
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ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC, VL .....................................................................-0.3V to +6V
R_, G_, B_, SDA1, SCL1, SDA2, SCL2,
H1, V1, (Note 1) ........................................-0.3V to VCC + 0.3V
H0, V0, SDA0, SCL0, EN, SEL.........................-0.3V to VL + 0.3V
Continuous Current through RGB Switches .....................±30mA
Continuous Current through DDC Switches .....................±30mA
Peak Current through RGB Switches
(pulsed at 1ms, 10% duty cycle)...................................±90mA
Peak Current through DDC Switches (pulsed at 1ms,
10% duty cycle)............................................................±90mA
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN (derate 27.8mW/°C above +70°C) ........2222mW
Junction to Ambient Thermal Resistance (
θJA) (Note 2)
24-Pin TQFN..................................................................36°C/W
Junction to Ambient Thermal Resistance (
θJC) (Note 2)
24-Pin TQFN....................................................................3°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(VCC = +5.0V ±10%, VL = +2V to +5.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5.0V, VL = +3.3V and
TA = +25°C.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
EN = VL
VCC Quiescent Supply Current
ICC
VCC = +5.0V
EN = GND
1A
EN = VL
VL Quiescent Supply Current
IVL
VL = +3.3V
EN = GND
1A
RGB ANALOG SWITCHES
On-Resistance
RON
VCC = +5.0V, IIN = -10mA, VIN = +0.7V
(Note 4)
6
Ω
On-Resistance Matching
ΔRON
0
≤ VIN ≤ 0.7V, IIN = -10mA
0.5
Ω
On-Resistance Flatness
RFLAT(ON)
0
≤ VIN ≤ 0.7V, IIN = -10mA
0.5
Ω
Off-Leakage Current
IL(OFF)
VCC = +5.5V, VIN = +0.3V or +5.5V,
VEN = 0 or VL
-1
+1
A
On-Leakage Current
IL(ON)
VCC = +5.5V, VIN = +0.3V or +5.5V,
VEN = VL
-1
+1
A
HV BUFFER
Input Voltage Low
VILHV
0.33 x
VL
V
Input Voltage High
VIHHV
0.66 x
VL
V
Input Logic Hysteresis
VHYST
75
mV
Input Leakage Current
IINHV
VCC = +5.5V, VL = +5.5V, VIN = 0 or VL
-1
+1
A
High-Output Drive Current
IOHHV
VOHHV
≥ 3.0V
8.0
mA
Low-Output Drive Current
IOLHV
VOLHV
≤ 0.6V
8.0
mA
Note 1: Signals exceeding VCC or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specifications. For detailed information
on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.