参数资料
型号: MAX4951BECTP+TGH7
厂商: Maxim Integrated Products
文件页数: 2/9页
文件大小: 0K
描述: IC RE-DRIVER SATA I/SATA 20-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 转接驱动器
驱动器/接收器数: 1/1
规程: SATA I / SATA II
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
封装/外壳: 20-WFQFN 裸露焊盘
供应商设备封装: 20-TQFN-EP(4x4)
包装: 带卷 (TR)
MAX4951
SATA I/SATA II Bidirectional Re-Driver
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, CL = 10nF, RL = 50, TA = 0°C to +70°C, unless otherwise noted. Typical values are at VCC = +3.3V, TA = +25°C.)
(Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
VCC ........................................................................-0.3V to +4.0V
HAP, HAM, DBP, DBM, EN, BA, BB
(Note 1)...................................................-0.3V to (VCC + 0.3V)
Short-Circuit Output Current
(HBP, HBM, DAP, DAM) .................................................90mA
Continuous Current at Inputs
(HAP, HAM, DBP, DBM) ...............................................±30mA
Continuous Current
(EN, BA, BB) ...................................................................±5mA
Continuous Power Dissipation (TA = +70°C)
20-Pin TQFN (derate 25.6mW/°C above +70°C) ..... 2051mW
Junction-to-Case Thermal Resistance (
θJC) (Note 2)
20-Pin TQFN...................................................................6°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 2)
20-Pin TQFN.................................................................39°C/W
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range .............................-55°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Power-Supply Range
VCC
3.0
3.6
V
BA = BB = VCC
90
125
Operating Supply Current
ICC
BA = BB = GND
70
100
mA
Standby Supply Current
ISTBY
EN = GND
7
10
mA
Single-Ended Input Resistance
ZRX-SE-DC
40
Differential Input Resistance
ZRX-DIFF-DC
85
100
115
Single-Ended Output Resistance
ZTX-SE-DC
40
Differential Output Resistance
ZTX-DIFF-DC
85
100
115
AC PERFORMANCE
f = 150MHz to 300MHz
-29
-18
f = 300MHz to 600MHz
-26
-14
f = 600MHz to 1200MHz
-22
-10
f = 1.2GHz to 2.4GHz
-18
-8
f = 2.4GHz to 3.0GHz
-15
-3
Differential Input Return Loss
(Note 4)
RLRX-DIFF
f = 3.0GHz to 5.0GHz
-14
-1
dB
f = 150MHz to 300MHz
-5
f = 300MHz to 600MHz
-5
f = 600MHz to 1200MHz
-2
f = 1.2GHz to 2.4GHz
-2
f = 2.4GHz to 3.0GHz
-2
Common-Mode Input Return Loss
(Note 4)
RLRX-CM
f = 3.0GHz to 5.0GHz
-1
dB
Note 1: All I/O pins are clamped by internal diodes.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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