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| 型号： | MAX4996ETG+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 6/13页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH TRIPLE DPDT 24TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 开关 |
| 电路： | 3 x DPDT |
| 导通状态电阻： | 4 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 2.5 V ~ 5.5 V |
| 电流 - 电源： | 5µA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
MAX4996/MAX4996L
Triple DPDT, Low-Capacitance Data Switches
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +2.5V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 2.8V, TA = +25°C.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations see www.maxim-ic.com/thermal-tutorial.
VCC to GND ...........................................................-0.3V to +6.0V
EN,
EN, CB_ ..........................................................-0.3V to +6.0V
All Other Pins to GND ..................................-0.3V to VCC + 0.3V
Continuous Current
NO_, NC_, COM_ .......................................................±150mA
Peak Current NO_, NC_, COM_
(pulsed at 1ms, 50% Duty Cycle)...............................±300mA
(pulsed at 1ms, 10% Duty Cycle)...............................±450mA
ESD per Human Body Model...............................................±2kV
Continuous Power Dissipation (TA = +70°C)
24-Pin TQFN (derate 20.8mW/°C
above +70°C).............................................................1228mW
Thermal Resistance (Note 1)
θJA.............................................................................65.1°C/W
θJC...............................................................................5.4°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering) .........................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ANALOG SWITCH
Analog Signal Range
VCOM,
VNO, VNC_
0VCC
V
On-Resistance
RON
VCOM_= 0 to VCC , ICOM_= 25mA2
4
Ω
On-Resistance Match Between
Channels
ΔRON
VCC = 2.8V, ICOM_= 25mA;
VNO_ = 1.5V or VNC _= 1.5V (Note 4)
0.1
0.2
Ω
On-Resistance Flatness
RFLAT
VCC = 2.5V, ICOM_= 25mA;
VCOM_= 0 to VCC (Note 5)
0.2
0.5
Ω
VCC = 4V, VCOM_ = 0, 4V;
VNO_ , VNC_ = 4V, 0
-250
+250
nA
Off-Leakage Current
ICOM_
(OFF)
VCC = 5.5V, VCOM_ = 5.5V;
VNO, VNC with 50A sink current to GND
180
A
On-Leakage Current
ICOM_ (ON)
VCC = 5.5V, VCOM_ = 0, 5.5V;
VNO_, VNC_unconnected
-250
+250
nA
-3dB Bandwidth
BW
RL = RS = 50
Ω, CL = 5pF, Figure 4
670
MHz
Off-Isolation
VISO
f = 1MHz, VNO_, VNC_ = 0;
CL = 5pF, RL = RS = 50
Ω,
Figure 4 (Note 6)
-60
dB
CrosstalkVCT
f = 1MHz, VNO_, VNC_ = 0;
RL = RS = 50
Ω, Figure 4 (Note 7)
-120
dB
LOGIC INPUTS
Input Logic High
VIH
1.4
V
Input Logic Low
VIL
0.5
V
Input Leakage Current
ILEAK
0
≤ V ≤ VIL and VIH ≤ V ≤ VCC;
VCC = 5.5V
-250
+250
nA
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