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参数资料
| 型号： | MAX4999ETJ+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 4/11页 |
| 文件大小： | 0K |
| 描述： | IC MULTIPLEXER 8X1 32TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 多路复用器 |
| 电路： | 1 x 8:1 |
| 导通状态电阻： | 12 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 3.6 V |
| 电流 - 电源： | 5µA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 供应商设备封装： | 32-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
MAX4999
USB 2.0 Hi-Speed Differential
8:1 Multiplexer
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (Note 2)
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25°C.) (Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC ...........................................................................-0.3V to +4V
All Other Pins (Note 1)..............................................-0.3V to +4V
Continuous Current (COM_ to any switch) .......................±60mA
Peak Current (COM_ to any switch) (pulsed at 1ms,
10% duty cycle)..........................................................±120mA
Continuous Power Dissipation (TA = +70°C)
32-Lead TQFN (derate 34.5mW/°C above +70°C) ....2759mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
TQFN
Junction-to-Ambient Thermal Resistance (
θJA) ............29°C/W
Junction-to-Case Thermal Resistance (
θJC) ...............2.0°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Supply Voltage
VCC
3.0
3.6
V
Charge pump on
5
Quiescent Supply Current
IO
Charge pump off
1
A
ANALOG SWITCH
On-Resistance
RON
ICOM_ = ±10mA
6.5
12
On-Resistance Match
RONSC VCOM_ = 1V, TA = +25°C
0.8
On-Resistance Match Between
Channels
RONBC VCOM_ = 1V, TA = +25°C
1
Leakage Current COM_, D_ _0,
D_ _1
IL
VCC = +3.6V
-1
+1
A
SWITCH AC PERFORMANCE (Note 4)
Crosstalk
VDCT1
Any switch to non-paired switch at 500MHz
(Figure 3)
-30
dB
Off-Isolation
VOFF
Any switch to non-paired switch at 240MHz
(Figure 3)
-27
dB
Bandwidth -3dB
BW
RL = 45
unbalanced (Figure 3)
1200
MHz
f = 1MHz
6
On-Capacitance
CON
Taken from S11 parameters at f = 240MHz
3.0
pF
f = 1MHz, COM_
5
Off-Capacitance
COFF
Taken from S11 parameters at f = 240MHz
3.0
pF
Propagation Delay
tPD
RL = RS = 50
(Figure 2)
300
ps
Turn-On Time
tON
VD_ _0 or VD_ _1 = +1.5V, RL = 300
,
CL = 35pF, VIH = VCC, VIL = 0V (Figure 1)
10
s
Note 1: Signals exceeding GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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