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参数资料
| 型号： | MAX532BEPE+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 4/16页 |
| 文件大小： | 0K |
| 描述： | IC MDAC 12BIT DUAL SER 16-DIP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 25 |
| 设置时间： | 2.5µs |
| 位数： | 12 |
| 数据接口： | 串行 |
| 转换器数目： | 2 |
| 电压电源： | 双 ± |
| 功率耗散（最大）： | 842mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 16-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 16-PDIP |
| 包装： | 管件 |
| 输出数目和类型： | 2 电压，单极；2 电压，双极 |
| 采样率（每秒）： | * |
MAX532
Output Amplifiers
The output amplifiers are stable with any combination
of resistive loads
≥ 2k and capacitive loads ≤ 100pF.
They are internally compensated, and settle to ±0.01%
FSR (1/2LSB) in 2.5s.
Unipolar Configuration
Figure 9 shows DACA connected for unipolar binary
operation. Similar connections apply for DACB. When
VIN is an AC signal, the circuit performs two-quadrant
multiplication. Table 2 shows the codes for this circuit.
Bipolar Operation
Figure 10 shows the MAX532 connected for bipolar
operation. The coding is offset binary, as shown in
Table 3. When VIN is an AC signal, the circuit performs
four-quadrant multiplication. To maintain gain error
specifications, resistors R1, R2, and R3 should be ratio-
matched to 0.01%.
__________Applications Information
Layout, Grounding, and Bypassing
For best system performance, use printed circuit boards
with separate analog and digital ground planes. Wire-
wrap boards are not recommended. The two ground
planes should be tied together at the low-impedance
power-supply source, as shown in Figure 11.
The board layout should ensure that digital and analog
signal lines are kept separate from each other as much
as possible. Do not run analog and digital lines parallel
to one another.
The output amplifiers are sensitive to high-frequency
noise in the VDD and VSS power supplies. Bypass
these supplies to the analog ground plane with 0.1F
and 10F bypass capacitors. Minimize capacitor lead
lengths for best noise rejection.
Dual, Serial-Input,
Voltage-Output, 12-Bit MDAC
12
______________________________________________________________________________________
1111 1111 1111
-VIN x (4095/4096)
1000 0000 0000
-VIN x (2048/4096) = -1/2VIN
0000 0000 0001
-VIN x (1/4096)
0000 0000 0000
0V
DAC Latch Contents
Table 2. Unipolar Code Table
1LSB = VIN/4096
DAC_
AGND_
VSS
DGND
RFB_
VOUT_
VIN
-12V to -15V
VDD
VREF_
+12V to +15V
MAX532
VOUT
R1
20k
R2
20k
R3
10k
Figure 10. Bipolar Operation
VDD
VSS
AGNDA
AGNDB
DGND
MAX532
+15V
-15V
AGND
+5V
DGND
ANALOG
SUPPLY
DIGITAL
SUPPLY
DIGITAL
CIRCUITRY
+5V
DGND
Figure 11. Power-Supply Grounding
Table 3. Bipolar Code Table
DAC Latch Contents
1111 1111 1111
+VIN x (2047/2048)
1000 0000 0001
+VIN x (1/2048)
1000 0000 0000
0V
0111 1111 1111
-VIN x (1/2048)
1LSB = VIN/2048
0000 0000 0000
-VIN + (2048/2048) = -VIN
MSB
LSB
Analog Output, VOUT
MSB
LSB
Analog Output, VOUT
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX532BEPE+ | 功能描述:数模转换器- DAC 12-Bit 2Ch Precision DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX532BEWE | 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX532BEWE+ | 功能描述:数模转换器- DAC 12-Bit 2Ch Precision DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX532BEWE+T | 功能描述:数模转换器- DAC 12-Bit 2Ch Precision DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX532BEWE-T | 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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