参数资料
型号: MAX5479ETE+T
厂商: Maxim Integrated Products
文件页数: 9/16页
文件大小: 0K
描述: IC POT DGTL DUAL 256-TAP 16-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
接片: 256
电阻(欧姆): 100k
电路数: 2
温度系数: 标准值 70 ppm/°C
存储器类型: 非易失
接口: I²C(设备位址)
电源电压: 2.7 V ~ 5.25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-TQFN(3x3)
包装: 带卷 (TR)
MAX5477/MAX5478/MAX5479
Dual, 256-Tap, Nonvolatile, I2C-Interface,
Digital Potentiometers
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.25V, H_ = VDD, L_ = GND, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VDD = +5V,
TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SDA, SCL, VDD to GND .........................................-0.3V to +6.0V
All Other Pins to GND.................................-0.3V to (VDD + 0.3V)
Maximum Continuous Current into H_, L_, and W_
MAX5477......................................................................
±5.0mA
MAX5478......................................................................
±1.3mA
MAX5479......................................................................
±0.6mA
Continuous Power Dissipation (TA = +70°C)
16-Pin TQFN (derate 17.5mW/°C above +70°C) .......1398mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (
θJA) ........57.2°C/W
Junction-to-Case Thermal Resistance (
θJC) ................40°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (
θJA) ......100.4°C/W
Junction-to-Case Thermal Resistance (
θJC) ................30°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC PERFORMANCE (VOLTAGE-DIVIDER MODE)
Resolution
256
Taps
Integral Nonlinearity
INL
(Note 3)
±1
LSB
Differential Nonlinearity
DNL
(Note 3)
±0.5
LSB
Dual Code Matching
R0 and R1 set to same code (all codes)
±1
LSB
End-to-End Resistance
Temperature Coefficient
TCR
70
ppm/°C
Ratiometric Resistance
Temperature Coefficient
10
ppm/°C
MAX5477
-4
MAX5478
-0.6
Full-Scale Error
MAX5479
-0.3
LSB
MAX5477
4
MAX5478
0.6
Zero-Scale Error
MAX5479
0.3
LSB
DC PERFORMANCE (VARIABLE-RESISTOR MODE)
VDD = 3V
±3
Integral Nonlinearity (Note 4)
INL
VDD = 5V
±1.5
LSB
MAX5477
±1
MAX5478
±1
Differential Nonlinearity (Note 4)
DNL
MAX5479
±1
LSB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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