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参数资料
| 型号： | MAX5712AUT+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 3/10页 |
| 文件大小： | 0K |
| 描述： | IC DAC SERIAL 12BIT 1CH SOT23-6 |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 设置时间： | 4µs |
| 位数： | 12 |
| 数据接口： | 串行 |
| 转换器数目： | 1 |
| 电压电源： | 单电源 |
| 功率耗散（最大）： | 727mW |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-6 |
| 包装： | 带卷 (TR) |
| 输出数目和类型： | 1 电压，单极 |
| 采样率（每秒）： | * |
MAX5712
12-Bit, Low-Power, Rail-to-Rail
Voltage-Output Serial DAC in SOT23
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.5V, GND = 0, RL = 5kΩ, CL = 200pF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VDD = +5V.
TA = +25°C)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
OUT, SCLK, DIN, CS to GND ......................-0.3V to (VDD+ 0.3V)
Maximum Current into Any Pin .........................................±50mA
Continuous Power Dissipation (TA = +70°C)
6-Pin SOT23 (derate 9.1mW/°C above +70°C)...........727mW
Operating Temperature Range .........................-40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC ACCURACY (NOTE 1)
Resolution
N
12
Bits
Differential Nonlinearity Error
DNL
Guaranteed monotonic (Note 2)
±1
LSB
Integral Nonlinearity Error
INL
(Note 2)
±2
±16
LSB
Zero-Code Error
OE
Code = 000
0.4
1.5
% of FS
Zero-Code Error Tempco
2.3
ppm/
°C
Gain Error
GE
Code = FFF hex
-3
% of FS
Gain-Error Tempco
Integral
0.26
ppm/
°C
DAC OUTPUT
Output Voltage Range
No-load (Note 3)
0
VDD
V
DC Output Impedance
Code = 800 hex
0.8
Ω
VDD = +3V
15
Short Circuit Current
VDD = +5V
48
mA
VDD = +3V
8
Wake-Up Time
VDD = +5V
8
s
Output Leakage Current
Power-down mode = output high-impedance
±18
±33
nA
DIGITAL INPUTS (SCLK, DIN,
CS)
Input High Voltage
VIH
VDD = +3V, +5V
0.7 x VDD
V
Input Low Voltage
VIL
VDD = +3V, +5V
0.3 x VDD
V
Input Leakage Current
IIN
Digital Inputs = 0 or VDD
±0.1
±1A
Input Capacitance
CIN
5pF
DYNAMIC PERFORMANCE
Voltage-Output Slew Rate
SR
0.5
V/s
Voltage-Output Settling Time
400 hex to C00 hex (Note 4)
4
10
s
Digital Feedthrough
Any digital inputs from 0 to VDD
0.2
nV-s
Digital-Analog Glitch Impulse
Major carry transition (code 7FF hex to code
800 hex)
12
nV-s
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SOT23
Junction-to-Ambient Thermal Resistance (
θJA)...............134.40°C/W
Junction-to-Case Thermal Resistance (
θJC)......................39°C/W
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