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参数资料
| 型号： | MAX5884EGM+D |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 6/18页 |
| 文件大小： | 0K |
| 描述： | IC DAC 14BIT 3.3V 200MSPS 48-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 43 |
| 设置时间： | 11ns |
| 位数： | 14 |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 134mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-QFN 裸露焊盘 |
| 供应商设备封装： | 48-QFN-EP（7x7） |
| 包装： | 管件 |
| 输出数目和类型： | 2 电流，单极 |
| 采样率（每秒）： | 200M |
MAX5884
3.3V, 14-Bit, 200Msps High Dynamic
Performance DAC with CMOS Inputs
14
______________________________________________________________________________________
Other key factors in selecting the appropriate DAC for
the Tx path of a multicarrier GSM/EDGE system is the
converter’s ability to offer superior IMD and MTPR perfor-
mance. Multiple carriers in a designated band generate
unwanted intermodulation distortion between the individ-
ual carrier frequencies. A multitone test vector usually
consists of several equally spaced carriers, usually four,
with identical amplitudes. Each of these carriers is rep-
resentative of a channel within the defined bandwidth of
interest. To verify MTPR, one or more tones are
removed such that the intermodulation distortion perfor-
mance of the DAC can be evaluated. Nonlinearities
associated with the DAC create spurious tones, some
of which may fall back into the area of the removed
tone, limiting a channel’s carrier-to-noise ratio. Other
spurious components falling outside the band of inter-
est can also be important, depending on the system’s
spectral mask and filtering requirements. Going back to
the GSM/EDGE Tx mask, the IMD specification for adja-
cent carriers varies somewhat among the different GSM
standards. For the PCS1800 and GSM850 standards,
the DAC must meet an average IMD of -70dBc.
Table 3 summarizes the dynamic performance require-
ments for the entire Tx signal chain in a four-carrier
GSM/EDGE-based system and compares the previous-
ly established converter requirements with a new-gen-
eration high dynamic performance DAC.
The four-tone MTPR plot in Figure 11 demonstrates the
MAX5884’s excellent dynamic performance. The center
frequency (fCENTER = 31.99MHz) has been removed to
allow detection and analysis of intermodulation or spuri-
ous components falling back into this empty spot from
adjacent channels. The four carriers are observed over
a 12MHz bandwidth and are equally spaced at 1MHz.
Each individual output amplitude is backed off to -12dB
FS. Under these conditions, the DAC yields an MTPR
performance of -82dBc.
Grounding, Bypassing, and Power-Supply
Considerations
Grounding and power-supply decoupling can strongly
influence the performance of the MAX5884. Unwanted
digital crosstalk may couple through the input, refer-
ence, power supply, and ground connections, affecting
dynamic performance. Proper grounding and power-
supply decoupling guidelines for high-speed, high-fre-
quency applications should be closely followed. This
reduces EMI and internal crosstalk that can significantly
affect the dynamic performance of the MAX5884.
Use of a multilayer printed circuit (PC) board with sepa-
rate ground and power-supply planes is recommend-
ed. High-speed signals should run on lines directly
above the ground plane. Since the MAX5884 has sepa-
rate analog and digital ground buses (AGND,
CLKGND, and DGND, respectively), the PC board
should also have separate analog and digital ground
sections with only one point connecting the two planes.
Digital signals should be run above the digital ground
plane and analog/clock signals above the analog/clock
ground plane. Digital signals should be kept as far
away from sensitive analog inputs, reference input
sense lines, common-mode input, and clock inputs as
practical. A symmetric design of clock input and analog
output lines is recommended to minimize 2nd-order
NUMBER OF
CARRIERS
CARRIER
POWER LEVEL
(dB FS)
DAC NOISE DENSITY
REQUIREMENT
(dB FS/Hz)
2
-6
-146
4
-12
-152
Table 2. GSM/EDGE Noise Requirements
for Multicarrier Systems
SPECIFICATION
SYSTEM TRANSMITTER
OUTPUT LEVELS
DAC REQUIREMENTS WITH
MARGINS
MAX5884 SPECIFICATIONS
SFDR
80dBc
86dBc
76dBc*
Noise Spectral Density
-130dBc/Hz
-152dB FS/Hz
-153dB FS/Hz
IMD
-70dBc
-75dBc
-74dBc
Carrier Amplitude
N/S
-12dB FS
Table 3. Summary of Important AC Performance Parameters for Multicarrier GSM/EDGE
Systems
*Measured within a 15MHz window.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5884EGM-TD | 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5885EGM | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX5885EGM+D | 功能描述:数模转换器- DAC 16-Bit 200Msps DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5885EGM+TD | 功能描述:数模转换器- DAC 16-Bit 200Msps DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5885EGM-D | 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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