参数资料
型号: MAX604CSA+
厂商: Maxim Integrated Products
文件页数: 8/12页
文件大小: 0K
描述: IC REG LDO 3.3V/ADJ .5A 8SOIC
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 100
稳压器拓扑结构: 正,固定式或可调式
输出电压: 3.3V,1.25 V ~ 11 V
输入电压: 2.7 V ~ 11.5 V
电压 - 压降(标准): 0.48V @ 400mA
稳压器数量: 1
电流 - 输出: 500mA
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
产品目录页面: 1408 (CN2011-ZH PDF)
MAX603/MAX604
5V/3.3V or Adjustable, Low-Dropout,
Low I Q , 500mA Linear Regulators
700
1.8
POWER DISSIPATION vs.
GROUND PAD AREA
MAXIMUM OUTPUT CURRENT vs. SUPPLY VOLTAGE
MAX603
MAXIMUM CONTINUOUS CURRENT LIMIT
1.7
1.6
600
500
HIGH-POWER
SOIC
1.5
1.4
1.3
1.2
1.1
1.0
0.2
1.3
1
6.5
MAX603, V OUT = 5V
8-PIN SO PACKAGE
PAPER EPOXY BOARD
SINGLE SIDED
1oz. COPPER
T J = +125°C
T A = +25°C STILL AIR
10 20 (in 2 )
65 130 (cm 2 )
400
300
200
100
0
4
5
PLASTIC DIP
OPERATING
REGION AT
T A = +25°C CERAMIC DIP
T J = +125°C
6 7 8 9 10 11 12
SUPPLY VOLTAGE (V)
13
COPPER GROUND PAD AREA
Figure 4. Typical Maximum Power Dissipation vs. Ground Pad
Size.
700
600
500
MAX604
MAXIMUM CONTINUOUS CURRENT LIMIT
HIGH-POWER SOIC
100
T A = +25°C
T J = +125°C
P MAX × ( T J - T A )
( V IN
)
I OUT ( max ) =
air, θ JB (or θ JC ) is the thermal resistance of the package
chosen, and θ BA is the thermal resistance through the
printed circuit board, copper traces and other materials
to the surrounding air. The 8-pin SOIC package for the
MAX603/MAX604 features a special lead frame with a
lower thermal resistance and higher allowable power
dissipation. The thermal resistance of this package is
θ JB = 42°C/W, compared with θ JB = 110°C/W for an 8-
pin plastic DIP package and θ JB = 125°C/W for an 8-pin
ceramic DIP package.
The GND pins of the MAX603/MAX604 SOIC package
perform the dual function of providing an electrical con-
nection to ground and channeling heat away. Connect
all GND pins to ground using a large pad or ground
plane. Where this is impossible, place a copper plane
on an adjacent layer. The pad should exceed the
dimensions in Figure 4.
Figure 4 assumes the IC is an 8-pin SOIC package, is
soldered directly to the pad, has a +125°C maximum
junction temperature and a +25°C ambient air tempera-
ture, and has no other heat sources. Use larger pad
sizes for other packages, lower junction temperatures,
higher ambient temperatures, or conditions where the IC
is not soldered directly to the heat-sinking ground pad.
The MAX603/MAX604 can regulate currents up to
500mA and operate with input voltages up to 11.5V, but
not simultaneously. High output currents can only be
sustained when input-output differential voltages are
8
400
300
PLASTIC DIP
200
OPERATING
REGION AT
CERAMIC DIP
0
2 3 4 5 6 7 8 9 10 11 12 13
SUPPLY VOLTAGE (V)
Figure 5. Power Operating Regions: Maximum Output Current
vs. Differential Supply Voltage
low, as shown in Figure 5. Maximum power dissipation
depends on packaging, board layout, temperature, and
air flow. The maximum output current is:
- V OUT × 100 ° C
where P MAX is derived from Figure 4.
Reverse-Current Protection
The MAX603/MAX604 has a unique protection scheme
that limits reverse currents when the input voltage falls
below the output. It monitors the voltages on IN and
OUT and switches the IC’s substrate and power bus to
Maxim Integrated
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相关代理商/技术参数
参数描述
MAX604CSA+ 功能描述:低压差稳压器 - LDO 3.3/5/AdjV 500mA LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MAX604CSA+T 功能描述:低压差稳压器 - LDO 3.3/5/AdjV 500mA LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MAX604CSA-T 功能描述:低压差稳压器 - LDO 3.3/5/AdjV 500mA LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MAX604EPA 功能描述:低压差稳压器 - LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20
MAX604EPA+ 功能描述:低压差稳压器 - LDO 3.3/5/AdjV 500mA LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压(最大值):307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20