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参数资料
| 型号： | MAX6401BS24+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/9页 |
| 文件大小： | 0K |
| 描述： | IC SUPERVISOR MPU 4-UCSP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 简单复位/加电复位 |
| 监视电压数目： | 1 |
| 输出： | 推挽式，图腾柱 |
| 复位： | 高有效 |
| 复位超时： | 最小为 100 ms |
| 电压 - 阀值： | 2.4V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-WFBGA，CSPBGA |
| 供应商设备封装： | 4-UCSP（1.05x1.05） |
| 包装： | 带卷 (TR) |
μP Supervisory Circuits in 4-Bump (2 ? 2)
Chip-Scale Package
Table 2. Device Marking Codes
PARTS
MAX6400 BS31-T
MAX6400BS30-T
MAX6400BS29-T
MAX6400BS28-T
MAX6400BS27-T
MAX6400BS26-T
MAX6400BS25-T
MAX6400BS24-T
MAX6400BS23-T
MAX6400BS22-T
PARTS
MAX6403 BS46-T
MAX6403BS45-T
MAX6403BS44-T
MAX6403BS43-T
MAX6403BS42-T
MAX6403BS41-T
MAX6403BS40-T
MAX6403BS39-T
MAX6403BS38-T
MAX6403BS37-T
MAX6403BS36-T
MAX6403BS35-T
MAX6403BS34-T
MAX6403BS33-T
TOP MARK
AAJ
AAI
AAH
AAG
AAF
AAE
AAD
AAC
AAB
AAA
TOP MARK
ACT
ACS
ACR
ACQ
ACP
ACO
ACN
ACM
ACL
ACK
ACJ
ACI
ACH
ACG
PARTS
MAX6401 BS31-T
MAX6401BS30-T
MAX6401BS29-T
MAX6401BS28-T
MAX6401BS27-T
MAX6401BS26-T
MAX6401BS25-T
MAX6401BS24-T
MAX6401BS23-T
MAX6401BS22-T
PARTS
MAX6404 BS46-T
MAX6404BS45-T
MAX6404BS44-T
MAX6404BS43-T
MAX6404BS42-T
MAX6404BS41-T
MAX6404BS40-T
MAX6404BS39-T
MAX6404BS38-T
MAX6404BS37-T
MAX6404BS36-T
MAX6404BS35-T
MAX6404BS34-T
MAX6404BS33-T
TOP MARK
ABV
ABU
ABT
ABS
ABR
ABQ
ABP
ABO
ABN
ABM
TOP MARK
ADH
ADG
ADF
ADE
ADD
ADC
ADB
ADA
ACZ
ACY
ACX
ACW
ACV
ACU
PARTS
MAX6402 BS31-T
MAX6402BS30-T
MAX6402BS29-T
MAX6402BS28-T
MAX6402BS27-T
MAX6402BS26-T
MAX6402BS25-T
MAX6402BS24-T
MAX6402BS23-T
MAX6402BS22-T
PARTS
MAX6405 BS46-T
MAX6405BS45-T
MAX6405BS44-T
MAX6405BS43-T
MAX6405BS42-T
MAX6405BS41-T
MAX6405BS40-T
MAX6405BS39-T
MAX6405BS38-T
MAX6405BS37-T
MAX6405BS36-T
MAX6405BS35-T
MAX6405BS34-T
MAX6405BS33-T
TOP MARK
ACF
ACE
ACD
ACC
ACB
ACA
ABZ
ABY
ABX
ABW
TOP MARK
ADV
ADU
ADT
ADS
ADR
ADQ
ADP
ADO
ADN
ADM
ADL
ADK
ADJ
ADI
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
ity tests. CSP reliability is integrally linked to the user ’ s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user ’ s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim ’ s qualification plan, test data, and
recommendations are detailed in the UCSP application
note, which can be found on Maxim ’ s website at
www.maxim-ic.com.
8
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相关PDF资料 |
PDF描述 |
|---|---|
| MAX6401BS25+T | IC SUPERVISOR MPU 4-UCSP |
| MAX6401BS28+T | IC SUPERVISOR MPU 4-UCSP |
| MAX6401BS27+T | IC SUPERVISOR MPU 4-UCSP |
| MAX6401BS26+T | IC SUPERVISOR MPU 4-UCSP |
| MAX6402BS29+T | IC SUPERVISOR MPU 4-UCSP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX6401BS25 | 制造商:Maxim Integrated Products 功能描述:MICROPROCESSOR SUPERVISORY CIRCUITS - Rail/Tube |
| MAX6401BS25+ | 制造商:Maxim Integrated Products 功能描述:PROCESSOR SUPERVISOR 2.5V 1UA 4UCSP - Rail/Tube |
| MAX6401BS25+T | 功能描述:监控电路 uPower Supervisor RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX6401BS25-T | 功能描述:监控电路 RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX6401BS26 | 制造商:Maxim Integrated Products 功能描述:MICROPROCESSOR SUPERVISORY CIRCUITS - Rail/Tube 制造商:Rochester Electronics LLC 功能描述: |
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