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| 型号： | MAX6406BS33+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | IC DETECTOR VOLT 4-UCSP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 简单复位/加电复位 |
| 监视电压数目： | 1 |
| 输出： | 推挽式，图腾柱 |
| 复位： | 低有效 |
| 复位超时： | 标准传输延迟为 20 µs |
| 电压 - 阀值： | 3.3V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-WFBGA，CSPBGA |
| 供应商设备封装： | 4-UCSP（1.05x1.05） |
| 包装： | 带卷 (TR) |
Voltage Detectors in 4-Bump (2 X 2)
Chip-Scale Package
V IN
DC/DC
V OUT
REGULATED 3.0V
CONVERTER
V CC
3.6V
Li+
μ P
V CC
MAX6408/
MAX6411
OUT
SUSPEND
MR (OPEN-DRAIN)
GND
Figure 1. Interfacing to Different Logic Voltage Components
Negative-Going V CC Transients
These devices are relatively immune to short-duration,
negative-going VCC transients (glitches).
The Typical Operating Characteristics show the
Maximum Transient Duration vs. Threshold Overdrive
graph, for which output pulses are not generated. The
graph shows the maximum pulse width that a negative-
going V CC transient may typically have before the
devices issue output signals. As the amplitude of the
transient increases, the maximum allowable pulse width
decreases.
UCSP Reliability
The chip-scale package (UCSP) represents a unique
TRANSISTOR COUNT: 512
PROCESS: BiCMOS
Chip Information
Pin Configuration
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
TOP VIEW AFTER ASSEMBLED ON PC BOARD (BUMPS AT THE BOTTOM)
ity tests. CSP reliability is integrally linked to the user ’ s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
MAX6406-
MAX6411
45 MIL
GND
A1
OUT (OUT)
B1
V CC
A2
MR
B2
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
45 MIL
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user ’ s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim ’ s qualification plan, test data, and
usage recommendations are detailed in the UCSP appli-
cation note, which can be found on Maxim ’ s website at
www.maxim-ic.com.
( ) ARE FOR MAX6407/MAX6410
UCSP
_______________________________________________________________________________________
7
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX6406BS34 | 制造商:Maxim Integrated Products 功能描述:VOLTAGE DETECTOR IN 4-BUMP 2X2 CHIP - Rail/Tube |
| MAX6406BS34+ | 制造商:Maxim Integrated Products 功能描述:VOLT SUPERVISOR DETECT 2.2V 4UCSP - Rail/Tube |
| MAX6406BS34+T | 功能描述:监控电路 Voltage Detector RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX6406BS34-T | 功能描述:监控电路 RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX6407BS22 | 制造商:Maxim Integrated Products 功能描述:VOLTAGE DETECTORS IN 4-BUMP (2 X 2) - Rail/Tube 制造商:Rochester Electronics LLC 功能描述: |
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