参数资料
型号: MAX6581TG9E+T
厂商: Maxim Integrated
文件页数: 2/27页
文件大小: 1212K
描述: IC TEMP SENSOR 8-CH PREC 24-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
功能: 温度监控器
传感器类型: 内部和外部
感应温度: -64°C ~ 150°C
精确度: ±3°C 本地(最大),±2.5°C 远程(最大)
输出类型: I²C?/SMBus?
输出警报:
输出风扇:
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 24-WFQFN 裸露焊盘
供应商设备封装: 24-TQFN-EP(4x4)
包装: 带卷 (TR)
2
Maxim Integrated
?癈 Accurate 8-Channel Temperature Sensor
MAX6581
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
CC
, SMBCLK, SMBDATA, ALERT,
OVERT, STBY to GND .........................................-0.3V to +4V
DXP_ to GND ............................................ -0.3V to (V
CC
 + 0.3V)
DXN_ to GND ........................................... -0.3V to (V
CC
 + 0.3V)
SMBDATA, ALERT, OVERT Current .................. -1mA to +50mA
DXN_ Current .................................................................... Q1mA
Continuous Power Dissipation (T
A
 = +70NC)
TQFN (derate 27.8mW/NC above +70NC) ................... 2222mW
ESD Protection (All Pins, Human Body Model) ...................Q2kV
Operating Temperature Range ........................-40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ..........................-65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
CC
 = +3.0V to +3.6V, T
A
 = -40NC to +125NC,
 
unless otherwise noted. Typical values are at V
CC
 = +3.3V and T
A
 = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ......36.0NC/W
Junction-to-Case Thermal Resistance (B
JC
) ..............3.0NC/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
V
CC
3.0
3.6
V
Standby Supply Current
I
SS
SMBus static
4
15
FA
Operating Current
I
CC1
During conversion, RC off
500
600
FA
I
CC2
During conversion, RC on
550
650
Temperature Resolution
11
Bits
0.125
NC
3-Sigma Temperature Accuracy
(Remote Channels 17)
V
CC
 = 3.3V
T
A
= +30NC to +85NC,
T
RJ
 = +60NC to +100NC
-0.85
+0.85
NC
T
A
, T
RJ
 = -40NC to +125NC
-1.2
+1.2
T
A
= +30NC to +85NC,
T
RJ
 = +100NC to +150NC
-2.5
+2.5
3-Sigma Temperature Accuracy
(Local)
V
CC
 = 3.3V
T
A
 = +30NC to +85NC
-1
+1
NC
T
A
 = -40NC to +125NC
-2
+2
T
A
 = 0NC to +150NC
-3
+3
6-Sigma Temperature Accuracy
(Remote Channels 17)
V
CC
 = 3.3V
T
A
= +30NC to +85NC,
T
RJ
 = +60NC to +100NC
-1
+1
NC
T
A
, T
RJ
 = -40NC to +125NC
-2
+2
T
A
= +30NC to +85NC,
T
RJ
 = +100NC to +125NC
-2.75
+2.75
6-Sigma Temperature Accuracy
(Local)
V
CC
 = 3.3V
T
A
 = +30NC to +85NC
-1.5
+1.5
NC
T
A
 = -40NC to +125NC
-2.5
+2.5
T
A
 = 0NC to +150NC
-3.5
+3.5
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