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参数资料
| 型号： | MAX6626PMTT+ |
| 厂商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分类： | 温度/湿度传感器 |
| 英文描述： | 9-Bit/12-Bit Temperature Sensors with I<sup>2</sup>C-Compatible Serial Interface in a SOT23 |
| 中文描述： | DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 2Cel, SQUARE, SURFACE MOUNT |
| 封装： | 3 X 3 MM, 0.80 MM HEIGHT, LEAD FREE, MO-2212WEEA, TDFN-6 |
| 文件页数： | 12/19页 |
| 文件大小： | 486K |
| 代理商： | MAX6626PMTT+ |
MAX6625/MAX6626
9-Bit/12-Bit Temperature Sensors with
I2C-Compatible Serial Interface in a SOT23
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(+3V ≤ VS ≤ +5.5V, TA = -55°C to +125°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VS to GND ................................................................-0.3V to +6V
OT, SCL, SDA to GND..............................................-0.3V to +6V
ADD to GND .................................................-0.3V to (VS + 0.3V)
Current into Any Pin............................................................±5mA
OT Sink Current.................................................................. 20mA
Continuous Power Dissipation
6-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW
6-Pin TDFN (derate 23.8mW/°C above +70°C) .........1905mW
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
ESD Rating (Human Body Model)......................................2000V
Lead Temperature .............................................................Note 1
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, IPC/JEDEC J-STD-020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Voltage
VS
3.0
5.5
V
I2C-compatible active
1
mA
I2C-compatible inactive
250
A
Quiescent Current
IC
Shutdown mode
1
A
MAX6625
9
ADC Resolution
MAX6626
12
Bits
MAX6625
0.5
Temperature Resolution
MAX6626
0.0625
°C/LSB
TA = +25
°C, VS = +3V to +3.6V
±1
0
°C = TA ≤ +50°C, VS = +3.0V to +3.6V
±1.5
Accuracy (Notes 2, 3)
0
°C = TA ≤ +70°C, VS = +3.0V to +3.6V
±2.0
°C
Power-Supply Sensitivity
VS = +3V to +5.5V
1
°C/V
Conversion Time
tC
133
ms
OT Pullup Resistor
RP
MAX6625R, MAX6626R only
25
50
k
OT Saturation Voltage (Note 4)
VL
IOUT = 4mA (Note 4)
0.8
V
OT Delay
(Programmable through fault queue)
1
× tC
6
× tC
ms
THIGH Default Temperature
THIGH
80
°C
TLOW Default Temperature
TLOW
75
°C
I2C-COMPATIBLE I/O: SCL, SDA, ADD
VS < +3.6V
2
Input High Voltage
VIH
VS > +3.6V
3
V
Input Low Voltage
VIL
0.8
V
Input Hysteresis
0.2
V
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