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参数资料
| 型号： | MAX6629MUT#TG16 |
| 厂商： | Maxim Integrated |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | IC TEMP SENSOR DIG SOT23-6 |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部 |
| 感应温度： | -55°C ~ 150°C |
| 精确度： | ±1°C（最小值） |
| 拓扑： | ADC（三角积分型） |
| 输出类型： | SPI? |
| 输出警报： | 无 |
| 输出风扇： | 无 |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -55°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-23-6 |
| 包装： | 带卷 (TR) |
12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Applications Information
Thermal Considerations
The key to accurate temperature monitoring is good
Functional Diagram
thermal contact between the MAX6629–MAX6632 pack-
age and the object being monitored. In some applica-
tions, the 6-pin SOT23 package is small enough to fit
underneath a socketed μP, allowing the device to moni-
tor the μP’s temperature directly. Accurate temperature
monitoring depends on the thermal resistance between
the object being monitored and the MAX6629–MAX6632
die. Heat flows in and out of plastic packages primarily
through the leads. If the sensor is intended to measure
MAX6629
MAX6630
MAX6631
MAX6632
TEMPERATURE
SENSOR
12-BIT + SIGN
∑Δ ADC
VOLTAGE
REFERENCE
the temperature of a heat-generating component on the
circuit board, it should be mounted as close as possible
to that component and should share supply and ground
traces (if they are not noisy) with that component where
possible. This maximizes the heat transfer from the com-
ponent to the sensor.
SPI-COMPATIBLE
INTERFACE
CS
SCK
SO
The MAX6629/MAX6630 supply current is typically
200μA, and the MAX6631/MAX6632 supply current is
typically 32μA. When used to drive high-impedance
loads, the device dissipates negligible power.
Therefore, the die temperature is essentially the same
as the package temperature.
The rise in die temperature due to self-heating is given
by the following formula:
Δ T J = P DISSIPATION x θ JA
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages . Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
where P DISSIPATION is the power dissipated by the
MAX6629–MAX6632, and θ JA is the package’s thermal
resistance.
The typical thermal resistance is +110°C/W for the
PACKAGE TYPE
6 SOT23
6 TDFN-EP
PACKAGE CODE
U6FH-6
T633+2
DOCUMENT NO.
6-pin SOT23 package. To limit the effects of self-heat-
ing, minimize the output currents. For example, if the
MAX6629–MAX6632 sink 1mA, the output voltage is
guaranteed to be less than 0.4V. Therefore, an addi-
tional 0.4mW of power is dissipated within the IC. This
corresponds to a 0.044°C shift in the die temperature in
the 6-pin SOT23.
_______________________________________________________________________________________
7
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相关代理商/技术参数 |
参数描述 |
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| MAX662AC/D | 功能描述:电荷泵 RoHS:否 制造商:Maxim Integrated 功能:Inverting, Step Up 输出电压:- 1.5 V to - 5.5 V, 3 V to 11 V 输出电流:100 mA 电源电流:1 mA 最大工作温度:+ 70 C 封装 / 箱体:SOIC-8 Narrow 封装:Tube |
| MAX662AC/D+ | 功能描述:电荷泵 RoHS:否 制造商:Maxim Integrated 功能:Inverting, Step Up 输出电压:- 1.5 V to - 5.5 V, 3 V to 11 V 输出电流:100 mA 电源电流:1 mA 最大工作温度:+ 70 C 封装 / 箱体:SOIC-8 Narrow 封装:Tube |
| MAX662ACPA | 功能描述:电荷泵 12V 30mA Flash Programming Supply RoHS:否 制造商:Maxim Integrated 功能:Inverting, Step Up 输出电压:- 1.5 V to - 5.5 V, 3 V to 11 V 输出电流:100 mA 电源电流:1 mA 最大工作温度:+ 70 C 封装 / 箱体:SOIC-8 Narrow 封装:Tube |
| MAX662ACPA+ | 功能描述:电荷泵 12V 30mA Flash Programming Supply RoHS:否 制造商:Maxim Integrated 功能:Inverting, Step Up 输出电压:- 1.5 V to - 5.5 V, 3 V to 11 V 输出电流:100 mA 电源电流:1 mA 最大工作温度:+ 70 C 封装 / 箱体:SOIC-8 Narrow 封装:Tube |
| MAX662ACSA | 功能描述:电荷泵 12V 30mA Flash Programming Supply RoHS:否 制造商:Maxim Integrated 功能:Inverting, Step Up 输出电压:- 1.5 V to - 5.5 V, 3 V to 11 V 输出电流:100 mA 电源电流:1 mA 最大工作温度:+ 70 C 封装 / 箱体:SOIC-8 Narrow 封装:Tube |
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