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| 型号： | MAX6661AEE+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 7/19页 |
| 文件大小： | 257K |
| 描述： | IC REG FAN SPEED 16-QSOP |
| 标准包装： | 2,500 |
| 功能： | 风扇控制，温度监控器 |
| 传感器类型： | 外部 |
| 感应温度： | 外部传感器 |
| 精确度： | ±5°C（最小值） |
| 拓扑： | ADC，比较器，风扇控制，多路复用器，寄存器库 |
| 输出类型： | SPI? |
| 输出警报： | 是 |
| 输出风扇： | 是 |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-QSOP |
| 包装： | 带卷 (TR) |
The transistor must be a small-signal type with a rela-
tively high forward voltage. Otherwise, the A/D input
range could be violated. The forward voltage must be
greater than 0.25V at 10礎. Check to ensure this is true
at the highest expected temperature. The forward volt-
age must be less than 0.95V at 100礎. Check to ensure
that this is true at the lowest expected temperature.
Large power transistors, power diodes, or small-signal
diodes must not be used. Also, ensure that the base
resistance is less than 100&. Tight specifications for
forward-current gain (50 < ?<150, for example) indi-
cate that the manufacturer has good process controls
and that the devices have consistent V
BE
characteris-
tics. Bits 52 of the mode register can be used to
adjust the ADC gain to achieve accurate temperature
measurements with diodes not included in the recom-
mended list or to calibrate individually the MAX6661 for
use in specific control systems.
Thermal Mass and Self-Heating
When measuring the temperature of a CPU or other IC
with an on-chip sense junction, the thermal mass of the
sensor has virtually no effect; the measured tempera-
ture of the junction tracks the actual temperature within
a conversion cycle. When measuring temperature with
discrete remote sensors, smaller packages (e.g., a
SOT23) yield the best thermal response times. Take
care to account for thermal gradients between the heat
source and the sensor, and ensure that stray air cur-
rents across the sensor package do not interfere with
measurement accuracy. Sensor self-heating, caused
by the diode current source, is negligible.
ADC Noise Filtering
The ADC is an integrating type with inherently good
noise rejection, especially of low-frequency noise such
as 60Hz line interference. Micropower operation places
constraints on high-frequency noise rejection; there-
fore, careful PC board layout and proper external noise
filtering are required for high-accuracy remote mea-
surements in electrically noisy environments. High-fre-
quency EMI is best filtered at DXP and DXN with an
external 2200pF capacitor. This value can be increased
to about 3300pF (max), including cable capacitance.
Capacitance higher than 3300pF introduces errors due
to the rise time of the switched current source. Nearly
all noise sources tested cause the ADC measurements
to be higher than the actual temperature, typically by
1癈 to 10癈, depending on the frequency and ampli-
tude (see Typical Operating Characteristics).
PC Board Layout
Follow these guidelines to reduce the measurement
error of the temperature sensors:
1) Place the MAX6661 as close as practical to the
remote diode. In noisy environments, such as a
computer motherboard, this distance can be 4in to
8in (typ). This length can be increased if the worst
noise sources are avoided. Noise sources include
CRTs, clock generators, memory buses, and
ISA/PCI buses.
2) Do not route the DXP-DXN lines next to the deflec-
tion coils of a CRT. Also, do not route the traces
across fast digital signals, which can easily intro-
duce a 30癈 error, even with good filtering.
3) Route the DXP and DXN traces in parallel and in
close proximity to each other, away from any higher
voltage traces, such as 12VDC. Leakage currents
from PC board contamination must be dealt with
carefully since a 20M& leakage path from DXP to
ground causes about a 1癈 error. If high-voltage
traces are unavoidable, connect guard traces to GND
on either side of the DXP-DXN traces (Figure 2).
4) Route through as few vias and crossunders as pos-
sible to minimize copper/solder thermocouple
effects.
Remote Temperature-Controlled Fan-Speed
Regulator with SPI-Compatible Interface
_______________________________________________________________________________________ 7
Note: Transistors must be diode connected (base shorted to
collector).
MANUFACTURER
MODEL NO.
Central Semiconductor (USA)
2N3904, 2N3906
Fairchild Semiconductor (USA)
2N3904, 2N3906
Rohm Semiconductor (Japan)
SST3904
Samsung (Korea)
KST3904-TF
Siemens (Germany)
SMBT3904
Zetex (England)
FMMT3904CT-ND
Table 1. Remote-Sensor Transistors
MINIMUM
10mils
10mils
10mils
10mils
GND
DXN
DXP
GND
Figure 2. Recommended DXP-DXN PC Trace
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| MAX6662EVKIT+ | 功能描述:板上安装温度传感器 MAX6662 Eval Kit RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| MAX6662MSA | 功能描述:板上安装温度传感器 RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| MAX6662MSA+ | 功能描述:板上安装温度传感器 12-Bit + Sign Temperature Sensor RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| MAX6662MSA+T | 功能描述:板上安装温度传感器 12-Bit + Sign Temperature Sensor RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| MAX6662MSA-T | 功能描述:板上安装温度传感器 RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
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