参数资料
型号: MAX6735KARVD3+T
厂商: Maxim Integrated Products
文件页数: 2/15页
文件大小: 0K
描述: IC SUPERVISOR MPU W/WD SOT23-8
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 多压监控器
监视电压数目: 3
输出: 推挽式,图腾柱
复位: 低有效
复位超时: 最小为 140 ms
电压 - 阀值: 1.575V,2.625V,可调
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: SOT-23-8
供应商设备封装: SOT-23-8
包装: 带卷 (TR)
MAX6730–MAX6735
Single-/Dual-/Triple-Voltage μP Supervisory
Circuits with Independent Watchdog Output
ABSOLUTE MAXIMUM RATINGS
V CC 1, V CC 2, RSTIN, MR , WDI to GND .....................-0.3V to +6V
RST , WDO to GND (open drain)...............................-0.3V to +6V
RST , WDO to GND (push-pull) .................-0.3V to (V CC 1 + 0.3V)
Input Current/Output Current (all pins) ...............................20mA
Continuous Power Dissipation (T A = +70°C)
6-Pin SOT23-6 (derate 4.3mW/°C above +70°C) .....347.8mW
8-Pin SOT23-8 (derate 5.6mW/°C above +70°C) .....444.4mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
Lead (Pb)-free packages.............................................+260°C
Package containing lead (Pb) .....................................+240°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
6 SOT23
Junction-to-Ambient Thermal Resistance ( θ JA ).......…230°C/W
Junction-to-Case Thermal Resistance ( θ JC )..............…76°C/W
8 SOT23
Junction-to-Ambient Thermal Resistance ( θ JA ).......…180°C/W
Junction-to-Case Thermal Resistance ( θ JC )..............…60°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V CC 1 = V CC 2 = +0.8V to +5.5V, T A = -40°C to +85°C, unless otherwise noted. Typical values are at T A = +25°C.) (Note 2)
PARAMETER
Supply Voltage
SYMBOL
V CC 1, V CC 2
CONDITIONS
MIN
0.8
TYP
MAX
5.5
UNITS
V
V CC 1 < +5.5V, all I/O connections
open, outputs not asserted
15
39
Supply Current
I CC 1
I CC 2
V CC 1 < +3.6V, all I/O connections
open, outputs not asserted
V CC 2 < +3.6V, all I/O connections
open, outputs not asserted
V CC 2 < +2.75V, all I/O connections
open, outputs not asserted
10
4
3
28
11
9
μA
L (falling)
M (falling)
T (falling)
S (falling)
4.500
4.250
3.000
2.850
4.625
4.375
3.075
2.925
4.750
4.500
3.150
3.000
V CC 1 Reset Threshold
V TH 1
R (falling)
2.550
2.625
2.700
V
2
Z (falling)
Y (falling)
W (falling)
V (falling)
2.250
2.125
1.620
1.530
2.313
2.188
1.665
1.575
2.375
2.250
1.710
1.620
Maxim Integrated
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