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| 型号： | MAX7301AAI+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 17/17页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER SPI 20B 28SSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 46 |
| 接口： | SPI/QSPI?/MICROWIRE? |
| 输入/输出数： | 20 |
| 中断输出： | 是 |
| 频率 - 时钟： | 26MHz |
| 电源电压： | 2.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 28-SSOP |
| 包装： | 管件 |
| 产品目录页面： | 1424 (CN2011-ZH PDF) |
External Component RISET
The MAX7301 uses an external resistor, RISET, to set
internal biasing. Use a resistor value of 39k
.
Applications Information
Low-Voltage Operation
The MAX7301 operates down to 2V supply voltage
(although the sourcing and sinking currents are not
guaranteed), providing that the MAX7301 is powered
up initially to at least 2.5V to trigger the device’s internal
reset, and also that the serial interface is constrained to
10Mbps.
SPI Routing Considerations
The MAX7301’s SPI interface is guaranteed to operate
at 26Mbps on a 2.5V supply, and on a 5V supply typi-
cally operates at 50Mbps. This means that transmission
line issues should be considered when the interface
connections are longer than 100mm, particularly with
higher supply voltages. Ringing manifests itself as
communication issues, often intermittent, typically due
to double clocking due to ringing at the SCLK input. Fit
a 1k
to 10k parallel termination resistor to either
GND or V+ at the DIN, SCLK, and
CS input to damp
ringing for moderately long interface runs. Use line-
impedance matching terminations when making con-
nections between boards.
PC Board Layout Considerations
For the TQFN version, connect the underside exposed
pad to GND. Ensure that all the MAX7301 GND connec-
tions are used. A ground plane is not necessary, but
may be useful to reduce supply impedance if the
MAX7301 outputs are to be heavily loaded. Keep the
track length from the ISET pin to the RISET resistor as
short as possible, and take the GND end of the resistor
either to the ground plane or directly to the ground pins.
Power-Supply Considerations
The MAX7301 operates with power-supply voltages of
2.5V to 5.5V. Bypass the power supply to GND with a
0.047F capacitor as close to the device as possible.
Add a 1F capacitor if the MAX7301 is far away from
the board’s input bulk decoupling capacitor.
Chip Information
TRANSISTOR COUNT: 30,316
PROCESS: CMOS
MAX7301
4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and
28-Port I/O Expander
_______________________________________________________________________________________
9
MICROCONTROLLER
SERIAL-DATA OUTPUT
SERIAL CS OUTPUT
SERIA-CLOCK OUTPUT
SERIAL-DATA INPUT
DIN
SCLK
CS
DOUT
DIN
SCLK
CS
DOUT
DIN
SCLK
CS
DOUT
MAX7301
Figure 3. Daisy-Chain Arrangement for Controlling Multiple MAX7301s
.
D15
= 0
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15 = 0
CS
SCLK
DIN
DOUT
Figure 4. Transmission of a16-Bit Write to the MAX7301
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX7301AAI+ | 功能描述:接口-I/O扩展器 2.5-5.5V 20/28 Port I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MAX7301AAI+T | 功能描述:接口-I/O扩展器 2.5-5.5V 20/28 Port I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MAX7301AAI-T | 功能描述:接口-I/O扩展器 2.5-5.5V 20/28 Port I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MAX7301AAX | 功能描述:接口-I/O扩展器 2.5-5.5V 20/28 Port I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| MAX7301AAX+ | 功能描述:接口-I/O扩展器 2.5-5.5V 20/28 Port I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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