参数资料
型号: MAX7301ATL+T
厂商: Maxim Integrated Products
文件页数: 8/17页
文件大小: 0K
描述: IC I/O EXPANDER SPI 28B 40TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
接口: SPI/QSPI?/MICROWIRE?
输入/输出数: 28
中断输出:
频率 - 时钟: 26MHz
电源电压: 2.5 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 40-WFQFN 裸露焊盘
供应商设备封装: 40-TQFN-EP(6x6)
包装: 带卷 (TR)
MAX7301
4-Wire-Interfaced, 2.5V to 5.5V, 20-Port and
28-Port I/O Expander
16
______________________________________________________________________________________
SSOP.EPS
PACKAGE OUTLINE, 36L SSOP, 0.80 MM PITCH
1
21-0040
E
REV.
DOCUMENT CONTROL NO.
APPROVAL
PROPRIETARY INFORMATION
TITLE:
FRONT VIEW
MAX
0.011
0.104
0.017
0.299
0.013
INCHES
0.291
0.009
E
C
DIM
0.012
0.004
B
A1
MIN
0.096
A
0.23
7.40
7.60
0.32
MILLIMETERS
0.10
0.30
2.44
MIN
0.44
0.29
MAX
2.65
0.040
0.020
L
0.51
1.02
H
0.414
0.398
10.11
10.51
e
0.0315 BSC
0.80 BSC
D
0.612
0.598
15.20
15.55
H
E
A1
A
D
e
B
0∞-8∞
L
C
TOP VIEW
SIDE VIEW
1
36
SSOP.EPS
PACKAGE OUTLINE, SSOP, 5.3 MM
1
21-0056
C
REV.
DOCUMENT CONTROL NO.
APPROVAL
PROPRIETARY INFORMATION
TITLE:
NOTES:
1. D&E DO NOT INCLUDE MOLD FLASH.
2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006").
3. CONTROLLING DIMENSION: MILLIMETERS.
4. MEETS JEDEC MO150.
5. LEADS TO BE COPLANAR WITHIN 0.10 MM.
7.90
H
L
0∞
0.301
0.025
8∞
0.311
0.037
0∞
7.65
0.63
8∞
0.95
MAX
5.38
MILLIMETERS
B
C
D
E
e
A1
DIM
A
SEE VARIATIONS
0.0256 BSC
0.010
0.004
0.205
0.002
0.015
0.008
0.212
0.008
INCHES
MIN
MAX
0.078
0.65 BSC
0.25
0.09
5.20
0.05
0.38
0.20
0.21
MIN
1.73
1.99
MILLIMETERS
6.07
10.07
8.07
7.07
INCHES
D
0.239
0.397
0.317
0.278
MIN
0.249
0.407
0.328
0.289
MAX
MIN
6.33
10.33
8.33
7.33
14L
16L
28L
24L
20L
MAX
N
A
D
e
A1
L
C
H
E
N
1
2
B
0.068
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
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