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参数资料
| 型号： | MAX8582ETB+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 8/10页 |
| 文件大小： | 0K |
| 描述： | IC CONV 1.5MHZ CDMA 10-TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 功能： | 降频器 |
| 频率： | 2.5MHz，1.5MHz |
| RF 型： | 手机，CDMA |
| 次要属性： | TDFN 内 60 兆欧 旁路 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 包装： | 标准包装 |
| 产品目录页面： | 1411 (CN2011-ZH PDF) |
| 其它名称： | MAX8582ETB+TDKR |
2.5MHz/1.5MHz Step-Down Converters
with 60m ? Bypass in TDFN for CDMA PA Power
Table 1. Suggested Inductors
MANUFACTURER
Coilcraft
Cooper
FDK
Panasonic
Sumida
Taiyo Yuden
TOKO
SERIES
LP03310
SD3110
SD3112
MIPF2520D
ELC3FN
CDRH2D09
CDRH2D11
CB2016
CBC2016
CB2518
CBC2518
NR3010
MDT2520-CR
D2812C
INDUCTANCE
(μH)
1.5
3.3
1.5
1.5
3.3
1.5
3.3
2.2
1.5
3.3
2.2
2.2
2.2
2.2
1.5
3.3
2.2
1.5
1.3
ESR
( ? )
0.10
0.16
0.11
0.10
0.17
0.07
0.10
0.12
0.05
0.10
0.13
0.20
0.09
0.13
0.08
0.14
0.08
0.11
0.17
CURRENT
RATING (mA)
1400
950
970
1090
840
1500
1200
1000
680
450
510
750
510
890
1200
840
700
900
730
DIMENSIONS
3.3 x 3.3 x 1.0 = 11mm 3
3.1 x 3.1 x 1.05 = 10mm 3
3.1 x 3.1 x 1.2 = 12mm 3
2.5 x 2.0 x 1.0 = 5mm 3
3.2 x 3.2 x 1.2 = 12mm 3
3.2 x 3.2 x 1.2 = 12mm 3
2.0 x 1.25 x 1.45 = 3.6mm 3
2.0 x 1.6 x 1.8 = 5.8mm 3
2.5 x 1.8 x 2.0 = 9mm 3
3.2 x 3.2 x 1.2 = 12mm 3
2.5 x 2.0 x 1.0 = 5mm 3
2.8 x 2.8 x 1.2 = 9.4mm 3
PCB Layout
Checklist
High switching frequencies and relatively large peak cur-
rents make the PCB layout a very important part of
design. Good design minimizes excessive EMI on the
feedback paths and voltage gradients in the ground
plane, both of which can result in instability or regulation
L1 = FDK MIPF2520 SERIES
1.5 μ H FOR MAX8581
3.3 μ H FOR MAX8582
C1, C2 = TAIYO YUDEN JMK105BJ225MV-B
GND
L1
errors. Connect the input capacitor close to IN and GND.
Connect the inductor and output capacitor as close to
the IC as possible and keep their traces short, direct,
and wide. Keep noisy traces, such as the LX node, as
IN
SHDN
C1
C2
OUT
GND
short as possible. Connect GND to the exposed paddle
directly under the IC. Figure 2 illustrates an example
PCB layout and routing scheme.
HP
REFIN
Chip Information
PROCESS: BiCMOS
Figure 2. Example PCB Layout and Routing Scheme
8
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX8582EVKIT+ | 制造商:Maxim Integrated Products 功能描述:MAX8582 EVAL KIT - Rail/Tube |
| MAX8585EUA | 功能描述:功率驱动器IC RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| MAX8585EUA+ | 功能描述:功率驱动器IC ORing MOSFET Controller RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| MAX8585EUA+T | 功能描述:功率驱动器IC ORing MOSFET Controller RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| MAX8585EUA-T | 功能描述:功率驱动器IC RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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