参数资料
型号: MAX8663ETL+T
厂商: Maxim Integrated Products
文件页数: 32/34页
文件大小: 0K
描述: IC PMIC LI+ SNGL CELL 40TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
应用: 手持/移动设备
电流 - 电源: 900µA
电源电压: 4.1 V ~ 8 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 40-WFQFN 裸露焊盘
供应商设备封装: 40-TQFN-EP(5x5)
包装: 带卷 (TR)
Power-Management ICs for
Single-Cell, Li+ Battery-Operated Devices
Power Dissipation
The MAX8662/MAX8663 have a thermal-limiting circuitry,
as well as a shutdown feature to protect the IC from dam-
age when the die temperature rises. To allow the maxi-
mum charging current and load current on each
regulator, and to prevent thermal overload, it is important
to ensure that the heat generated by the
MAX8662/MAX8663 is dissipated into the PCB. The pack-
age’s exposed paddle must be soldered to the PCB, with
multiple vias tightly packed under the exposed paddle to
ensure optimum thermal contact to the ground plane.
Table 5 shows the thermal characteristics of the
MAX8662/MAX8663 packages. For example, the junc-
tion-to-case thermal resistance ( θ JC ) of the MAX8663 is
1.7°C/W. When properly mounted on a multilayer PCB,
the junction-to-ambient thermal resistance ( θ JA ) is typi-
cally 28°C/W.
PCB Layout and Routing
High switching frequencies and relatively large peak
currents make the PCB layout a very important aspect of
design. Good design minimizes ground bounce, exces-
in the ground plane, which can result in instability or
regulation errors.
A separate low-noise analog ground plane containing
the reference, linear regulator, signal ground, and GND
must connect to the power-ground plane at only one
point to minimize the effects of power-ground currents.
PG_, DC power, and battery grounds must connect
directly to the power-ground plane. Connect GND to
the exposed paddle directly under the IC. Use multiple
tightly spaced vias to the ground plane under the
exposed paddle to help cool the IC.
Position input capacitors from DC, SYS, BAT, PV1, and
PV2 to the power-ground plane as close as possible to
the IC. Connect input capacitors and output capacitors
from inputs of linear regulators to low-noise analog
ground as close as possible to the IC. Connect the
inductors, output capacitors, and feedback resistors as
close to the IC as possible and keep the traces short,
direct, and wide.
Refer to the MAX8662/MAX8663 evaluation kit for a
suitable PCB layout example.
sive EMI on the feedback paths, and voltage gradients
Table 5. MAX8662/MAX8663 Package Thermal Characteristics
48-PIN THIN QFN (6mm x 6mm)
40-PIN THIN QFN (5mm x 5mm)
SINGLE-LAYER PCB
MULTILAYER PCB
SINGLE-LAYER PCB
MULTILAYER PCB
CONTINUOUS
POWER
DISSIPATION
θ JA
θ JC
2105.3mW
Derate 26.3mW/°C above
+70°C
38°C/W
1.4°C/W
2963.0mW
Derate 37.0mW/°C above
+70°C
27°C/W
1.4°C/W
1777.8mW
Derate 22.2mW/°C above
+70°C
45°C/W
1.7°C/W
2857.1mW
Derate 35.7mW/°C above
+70°C
28°C/W
1.7°C/W
32
______________________________________________________________________________________
相关PDF资料
PDF描述
RMC06DREI-S734 CONN EDGECARD 12POS .100 EYELET
HMC05DRTN-S734 CONN EDGECARD 10POS DIP .100 SLD
HBM18DSUH CONN EDGECARD 36POS .156 DIP SLD
RCC06DRYI-S93 CONN EDGECARD 12POS DIP .100 SLD
EVAL-ADF4252EBZ2 BOARD EVAL ADF4252 NO VCO/FILTER
相关代理商/技术参数
参数描述
MAX8663EVKIT+ 制造商:Maxim Integrated Products 功能描述:MAX8663 EVAL KIT - Boxed Product (Development Kits)
MAX8664AEEP+ 功能描述:DC/DC 开关控制器 Dual-Output Step Step-Down Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
MAX8664AEEP+T 功能描述:DC/DC 开关控制器 Dual-Output Step Step-Down Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
MAX8664BEEP+ 功能描述:DC/DC 开关控制器 Dual-Output Step Step-Down Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
MAX8664BEEP+T 功能描述:DC/DC 开关控制器 Dual-Output Step Step-Down Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK