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参数资料
| 型号： | MAX8753ETI+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | IC DC-DC CONV TFT LCD 28TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 转换器，TFT，LCD |
| 输入电压： | 2.6 V ~ 5.5 V |
| 输出数： | 4 |
| 输出电压： | 2.6 V ~ 13 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 供应商设备封装： | 28-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
TFT LCD DC-DC Converter with
Integrated Charge Pumps
Applications Information
Power Dissipation
An IC ’ s maximum power dissipation depends on the
thermal resistance from the die to the ambient environ-
ment and the ambient temperature. The thermal resis-
tance depends on the IC package, PC board copper
area, other thermal mass, and airflow.
The MAX8753, with its exposed backside paddle sol-
dered to 1in 2 of PC board copper, can dissipate about
1.7W into +70 ° C still air. More PC board copper, cooler
ambient air, and more airflow increase the possible dissi-
pation while less copper or warmer air decreases the
IC ’ s dissipation capability. The major components of
power dissipation are the power dissipated in the step-
up regulator, the linear regulator, and the charge pumps.
Step-Up Regulator
The largest portions of power dissipation in the step-up
regulator are the internal MOSFET, inductor, and the
output diode. If the step-up regulator has 90% efficien-
cy, approximately 3% to 5% of the power is lost in the
internal MOSFET, approximately 3% to 4% in the induc-
tor, and approximately 1% in the output diode. The
remaining 1% to 3% is distributed among the input and
output capacitors and the PC board traces. If the input
power is approximately 5W, the power lost in the inter-
nal MOSFET is approximately 150mW to 250mW.
Linear Regulator
The power dissipation in the linear regulator is:
P D ( LOGIC ) = ( V IN ? V LOGIC ) × I LOGIC
Positive Charge-Pump Regulator
The power dissipation in the positive charge-pump reg-
ulator is:
P D ( POS ) = ( 3 × V MAIN ? V POS ) × I POS
Negative Charge-Pump Regulator
The power dissipation in the negative charge-pump
regulator is:
P D ( NEG ) = ( n NEG xV SUPN + V NEG ) × I NEG
PC Board Layout and Grounding
Careful PC board layout is important for proper opera-
tion. Use the following guidelines for good PC board
layout:
1) Minimize the area of the step-up regulator ’ s high-
current loops by placing the inductor (L1), output
diode (D1), and output capacitor (C MAIN ) near the
input capacitor (C IN ) and near the LX and PGND
pins. The high-current input loop goes from the posi-
tive terminal of C IN to L 1 , to the IC ’ s LX pin, out of
PGND, and to C IN ’ s negative terminal. The high-cur-
rent output loop is from the positive terminal of C IN
to L1, to the output diode (D1), to the positive termi-
nal of C MAIN , reconnecting between the output
capacitor and input capacitor ground terminals.
Connect these loop components with short, wide
connections. Avoid using vias in the high-current
paths. If vias are unavoidable, use many vias in par-
allel to reduce resistance and inductance.
2) Create a power-ground island (PGND) consisting of
the input and output capacitor grounds, PGND pin,
the charge-pump input capacitors, output capaci-
tors, and diodes. Connect these together with short,
wide traces or a small ground plane. Maximizing the
width of the power-ground traces improves efficien-
cy and reduces output-voltage ripple and noise
spikes. Create an analog-ground plane (AGND)
consisting of the GND pin, all the feedback-divider
ground connections, the INTG and DEL capacitor
ground connections, and the device ’ s exposed
backside pad. Connect the AGND and PGND
islands by connecting the PGND pin directly to the
exposed backside pad. Make no other connections
between these separate ground planes.
3) Place the feedback voltage-divider resistors as close
to the feedback pin as possible. The divider ’ s center
trace should be kept short. Placing the resistors far
away causes the FB traces to become antennas that
can pick up switching noise. Care should be taken to
avoid running any feedback trace near LX or the
switching nodes in the charge pumps.
4) Place the IN and OUTL bypass capacitors as close
to the device as possible. The ground connections
of the IN and OUTL bypass capacitors should be
connected directly to the PGND plane near the
PGND pin with a wide trace.
18
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相关代理商/技术参数 |
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|---|---|
| MAX8753EVKIT | 功能描述:电源管理IC开发工具 MAX8753 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX8756ETI+ | 功能描述:电流和电力监控器、调节器 Interleaved Dual Power-Supply Ctlr RoHS:否 制造商:STMicroelectronics 产品:Current Regulators 电源电压-最大:48 V 电源电压-最小:5.5 V 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:HPSO-8 封装:Reel |
| MAX8756ETI+T | 功能描述:电流和电力监控器、调节器 Interleaved Dual Power-Supply Ctlr RoHS:否 制造商:STMicroelectronics 产品:Current Regulators 电源电压-最大:48 V 电源电压-最小:5.5 V 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:HPSO-8 封装:Reel |
| MAX8757ETG+ | 制造商:Maxim Integrated Products 功能描述:INTERLEAVED HI-EFF AND DUAL PS CNTRLR 24TQFN EP - Rail/Tube |
| MAX8757ETI+ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
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