参数资料
型号: MAX8798EVCMAXQU+
厂商: Maxim Integrated Products
文件页数: 27/31页
文件大小: 0K
描述: KIT EVAL FOR MAX8798
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
主要目的: 特殊用途 DC/DC,LCD 电源
输出及类型: 4,非隔离
功率 - 输出: 3.56W
输出电压: 8V,3.2V,21V,-13V
电流 - 输出: 300mA,150mA,20mA,20mA
输入电压: 1.8 ~ 6 V
稳压器拓扑结构: 升压
频率 - 开关: 1.2MHz
板类型: 完全填充
已供物品: 2 板,CD
已用 IC / 零件: MAX8798
Internal-Switch Boost Regulator with
Integrated 3-Channel Scan Driver for TFT LCDs
PCB Layout and Grounding
Careful PCB layout is important for proper operation.
Use the following guidelines for good PCB layout:
BOOST and VL bypass capacitor ground connec-
tions, and the device’s exposed backside paddle.
Connect the AGND and PGND islands by connect-
?
Minimize the area of high-current loops by placing
the inductor, output diode, and output capacitors
near the input capacitors and near LX and PGND.
ing the PGND pin directly to the exposed backside
paddle. Make no other connections between these
separate ground planes.
The high-current input loop goes from the positive
terminal of the input capacitor to the inductor, to the
IC’s LX pin, out of PGND, and to the input capaci-
tor’s negative terminal. The high-current output loop
is from the positive terminal of the input capacitor to
the inductor, to the output diode (D1), to the posi-
tive terminal of the output capacitors, reconnecting
between the output capacitor and input capacitor
ground terminals. Connect these loop components
with short, wide connections. Avoid using vias in
the high-current paths. If vias are unavoidable, use
many vias in parallel to reduce resistance and
inductance.
?
?
Place the feedback-voltage-divider resistors as
close as possible to the feedback pin. The divider’s
center trace should be kept short. Placing the resis-
tors far away causes the FB trace to become an
antenna that can pick up switching noise. Care
should be taken to avoid running the feedback
trace near LX or the switching nodes in the charge
pumps.
Place the IN pin and VL pin bypass capacitors as
close as possible to the device. The ground con-
nections of the IN and VL bypass capacitors should
be connected directly to the AGND pin with a wide
trace.
?
Create a power ground island (PGND) consisting of
the input and output capacitor grounds, PGND pin,
and any charge-pump components. Connect all
these together with short, wide traces or a small
ground plane. Maximizing the width of the power
ground traces improves efficiency and reduces out-
put-voltage ripple and noise spikes. Create an ana-
log ground plane (AGND) consisting of the AGND
?
?
Minimize the length and maximize the width of the
traces between the output capacitors and the load
for best transient responses.
Minimize the size of the LX node while keeping it
wide and short. Keep the LX node away from the
feedback node and analog ground. Use DC traces
as shield if necessary.
pin, all the feedback-divider ground connections, the
operational-amplifier-divider ground connections,
the COMP capacitor ground connection, the
Refer to the MAX8798 evaluation kit for an example of
proper board layout.
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