参数资料
型号: MAX8805ZEWECD+T
厂商: Maxim Integrated Products
文件页数: 17/24页
文件大小: 0K
描述: IC CONV STP-DN PWM 600MA 16WLP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
应用: 转换器,WCDMA PA 电源
输入电压: 2.7 V ~ 5.5 V
输出数: 1
输出电压: 0.4 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-UFBGA,WLCSP
供应商设备封装: 16-WLP(2x2)
包装: 带卷 (TR)
600mA/650mA PWM Step-Down Converters in
2mm x 2mm WLP for WCDMA PA Power
MAX8805W/MAX8805X/MAX8805Y/MAX8805Z. The
impedance of C IN1 at the switching frequency should
be kept very low. Ceramic capacitors with X5R or X7R
dielectric are highly recommended due to their small
size, low ESR, and small temperature coefficients. A
2.2μF capacitor is recommended for most applications.
For optimum noise immunity and low input ripple, the
input capacitor value can be increased.
For the LDOs, use an input capacitance equal to the
value of the sum of the output capacitance of LDO1 and
LDO2. Larger input capacitor values and lower ESR pro-
vide better noise rejection and line transient response.
Note that some ceramic dielectrics exhibit large capaci-
tance and ESR variation with temperature. With
dielectrics such as Z5U and Y5V, it may be necessary to
use two times the sum of the output capacitor values of
LDO1 and LDO2 (or larger) to ensure stability at temper-
atures below -10°C. With X7R or X5R dielectrics, a
capacitance equal to the sum is sufficient at all operating
temperatures.
Thermal Considerations
In most applications, the MAX8805W/MAX8805X/
MAX8805Y/MAX8805Z do not dissipate much heat due
to their high efficiency. However, in applications where
the MAX8805W/MAX8805X/MAX8805Y/MAX8805Z run
at high ambient temperature with heavy loads, the heat
dissipated may exceed the maximum junction tempera-
ture of the IC. If the junction temperature reaches
approximately +160°C, all power switches are turned
off and LX and PA_ become high impedance, and
LDO1 and LDO2 are pulled down to ground through an
internal 1k ? pulldown resistor.
The MAX8805W/MAX8805X/MAX8805Y/MAX8805Z
maximum power dissipation depends on the thermal
resistance of the IC package and circuit board, the
temperature difference between the die junction and
ambient air, and the rate of airflow. The power dissipat-
ed in the device is:
P DISS = P PA x (1/ η PA - 1) + I LDO1 x (V IN2 - V LDO1 ) +
I LDO2 x (V IN2 - V LDO2 )
where η PA is the efficiency of the PA step-down con-
verter and P PA is the output power of the PA step-down
converter.
The maximum allowed power dissipation is:
P MAX = (T JMAX - T A ) / θ JA
where (T JMAX - T A ) is the temperature difference
between the MAX8805W/MAX8805X/MAX8805Y/
MAX8805Z die junction and the surrounding air; θ JA is
the thermal resistance of the junction through the PCB,
copper traces, and other materials to the surrounding air.
PCB Layout
High switching frequencies and relatively large peak
currents make the PCB layout a very important part of
design. Good design minimizes excessive EMI on the
feedback paths and voltage gradients in the ground
plane, resulting in a stable and well-regulated output.
Connect C IN1 close to IN1A/IN1B and PGND. Connect
the inductor and output capacitor as close as possible
to the IC and keep their traces short, direct, and wide.
Keep noisy traces, such as the LX node, as short as
possible. Figure 3 illustrates an example PCB layout
and routing scheme.
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17
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MAX8805ZEWECC+T IC CONV STP-DN PWM 600MA 16WLP
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