参数资料
型号: MAX8808XETA+T
厂商: Maxim Integrated Products
文件页数: 5/13页
文件大小: 0K
描述: IC BATT CHRGR 1-CELL LI+ 8TDFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
功能: 充电管理
电池化学: 锂离子(Li-Ion)、锂聚合物(Li-Pol)
电源电压: 0 V ~ 15 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-WFDFN 裸露焊盘
供应商设备封装: 8-TDFN-EP(2x2)
包装: 标准包装
其它名称: MAX8808XETA+TDKR
1A Linear Li+ Battery Chargers with Integrated Pass
FET and Thermal Regulation in 2mm x 2mm TDFN
Pin Description
PIN
1
2
3
4
5
6
7
8
NAME
IN
VL
GND
ISET
CHG
EN
(MAX8808X/
MAX8808Z)
EN
(MAX8808Y)
ACOK
BATT
EP
FUNCTION
Input Supply Voltage. Bypass IN to GND with a 1μF or larger ceramic capacitor to improve line
noise and input transient rejection.
Internally Generated Logic Supply for IC. Bypass VL to GND with a 0.47μF ceramic capacitor.
Ground. Connect GND and exposed pad to a large copper ground plane for maximum power
dissipation. Connect GND to the exposed paddle directly under the IC.
Charge-Current Program and Fast-Charge Current Monitor. Output current from ISET is 1.08mA
per amp of battery charging current. Set the charging current by connecting a resistor from ISET
to GND. Fast-charge current = 1302V / R ISET ? .
Charging Indicator. CHG is an open-drain output that goes low (LED capable) when charging
begins. CHG is high impedance when the battery current drops below 10% of the fast-charging
current, or when the IC is disabled. Connect a pullup resistor to the μP’s I/O voltage when
interfacing with a μP logic input.
Logic-Level Enable Input. Drive EN high to disable charger. Pull EN low or leave unconnected for
normal operation. EN has an internal 200k ? pulldown resistor.
Logic-Level Enable Input. Drive EN low to disable charger. Pull EN high for normal operation. EN
has no internal pullup or pulldown resistor.
Input Status Indicator. ACOK is an open-drain output that asserts low when V IN < +7V and (V IN –
V BATT ) ≥ 40mV. ACOK requires an external 100k ? pullup resistor. ACOK is high impedance
during shutdown.
Li+ Battery Connection. Bypass BATT to GND with a ceramic capacitor of at least 2.2μF per
ampere of charge current.
Exposed Paddle. Connect the exposed paddle to a large ground plane for maximum power
dissipation. Connect GND to the exposed paddle directly under the IC.
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5
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