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| 型号： | MAX8971EWP+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 4/39页 |
| 文件大小： | 0K |
| 描述： | IC DCDC CHRGR LI+ 1CELL 20WLP |
| 标准包装： | 2,500 |
| 功能： | 充电管理，过压/欠压保护 |
| 电池化学： | 锂离子（Li-Ion）、锂聚合物（Li-Pol） |
| 电源电压： | 4 V ~ 7.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | * |
| 封装/外壳： | * |
| 供应商设备封装： | * |
| 包装： | * |
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MAX8971
Industry's Smallest 1.55A
1-Cell Li+ DC-DC Charger
ABSOLUTE MAXIMUM RATINGS
BYP to PG_ ...........................................................-0.3V to +22V
DC_ to BYP ............................................................-6V to +0.3V
I2CIN, V ICHG , IRQB, SDA, SCL to GND .................-0.3V to +6V
BST to AVL ............................................................-0.3V to +16V
BST to LX_ ...............................................................-0.3V to +6V
PVL, SFO, BAT, CS to PG_ .....................................-0.3V to +6V
Continuous Power Dissipation (T A = +70 N C)
WLP derate 21.7mW/ N C above +70 N C .....................1736mW
Operating Temperature Range. ......................... -40 N C to +85 N C
Junction Temperature. ....................................................+150 N C
Storage Temperature Range ............................ -65 N C to +150 N C
Soldering Temperature (reflow) ......................................+260 N C
AVL, THM to GND ...................................................-0.3V to +6V
PG_ to GND ..........................................................-0.3V to +0.3V
DC_, LX_, CS, BAT, BYP Continuous Current ............. 1.6A RMS
*This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be
exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the
industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR / VPR and Convection reflow. Preheating is required.
Hand or wave soldering is not allowed.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
WLP
Junction-to-Ambient Thermal Resistance ( q JA ) ..........46°C/W
Junction-to-Case Thermal Resistance ( q JC ) .................2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V DC = 5V, C BYP = 1 F F, I FCHG = 500mA, C AVL = 4.7 F F, V THM = AVL/2, T A = -40 N C to +85 N C, unless otherwise noted. Typical values
are at T A = +25 N C.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DC INPUT
DC Operating Voltage Range
4.0
V OVP
V
DC Undervoltage Lockout
DC rising, 500mV hysteresis
3.6
3.8
4.0
V
DC Overvoltage Threshold (V OVP )* DC rising, 250mV hysteresis
DC OVP Interrupt Delay
7.25
7.5
16
7.75
V
ms
DC to BAT Shutdown Threshold
DC Supply Current
When charging stops, V DC falling, 150mV hysteresis
Charger enabled, V DC = 5.5 V
0
50
2
100
mV
mA
BST Leakage Current
LX_ Leakage Current
BAT Reverse Leakage Current
Input-Current Limit Range
V BST = 5.5V, LX_ = PG_
V LX_ = 0 or 5.5V
V DC = 0V, V BAT = 4.2V
T A = +25 ° C
T A = -40 ° C to +85 ° C
T A = +25 ° C
T A = -40 ° C to +85 ° C
0.1
0.01
0.1
0.01
0.1
1
10
10
5
1.5
F A
F A
A
Maxim Integrated
4
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