参数资料
型号: MAX9209EVKIT+
厂商: Maxim Integrated Products
文件页数: 11/18页
文件大小: 0K
描述: KIT EVAL FOR MAX9209
其它有关文件: Automotive Product Guide
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
主要目的: 接口,串行器,解串器(串并行转换器)
已用 IC / 零件: MAX9209
已供物品:
MAX9209/MAX9213
Programmable DC-Balanced
21-Bit Serializers
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, RL = 100
±1%, PWRDWN = high, DCB/NC = high or low, unless otherwise noted. Typical values are at VCC
= +3.3V, TA = +25
°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to GND ...........................................................-0.5V to +4.0V
LVDS Outputs (TxOUT_, TxCLK OUT_) to GND ...-0.5V to +4.0V
5V Tolerant LVTTL/LVCMOS Inputs
(TxIN_, TxCLK IN, PWRDWN) to GND ..............-0.5V to +6.0V
(DCB/NC) to GND ......................................-0.5V to (VCC + 0.5V)
LVDS Outputs (TxOUT_, TxCLK OUT_)
Short to GND and Differential Short .......................Continuous
Continuous Power Dissipation (multilayer board, TA = +70°C)
48-Pin TSSOP (derate 16mW/°C above +70°C) ....... 1282mW
48-Pin TQFN (derate 40mW/°C above +70°C) ..........3200mW
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
ESD Protection
Human Body Model (RD = 1.5k
, CS = 100pF)
All Pins to GND..............................................................
±2kV
IEC 61000-4-2 (RD = 330
, CS = 150pF)
Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....
±8kV
Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..
±15kV
ISO 10605 (RD = 2k
, CS = 330pF)
Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....
±8kV
Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..
±25kV
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SINGLE-ENDED INPUTS (TxIN_, TxCLK IN,
PWRDWN, DCB/NC)
TxIN_, TxCLK IN, PWRDWN
2.0
5.5
High-Level Input Voltage
VIH
DCB/NC
2.0
VCC +
0.3
V
Low-Level Input Voltage
VIL
-0.3
+0.8
V
Input Current
IIN
VIN = high or low, PWRDWN = high or low
-20
+20
A
Input Clamp Voltage
VCL
ICL = -18mA
-0.9
-1.5
V
LVDS OUTPUTS (TxOUT_, TxCLK OUT)
Differential Output Voltage
VOD
Figure 1
250
350
450
mV
Change in VOD Between
Complementary Output States
VOD
Figure 1
2
25
mV
Output Offset Voltage
VOS
Figure 1
1.125
1.25
1.375
V
Change in VOS Between
Complementary Output States
VOS
Figure 1
10
30
mV
VOUT+ or VOUT- = 0V or VCC,
non-DC-balanced mode
-10
±5.7
+10
Output Short-Circuit Current
IOS
VOUT+ or VOUT- = 0V or VCC,
DC-balanced mode
-15
±8.2
+15
mA
VOD = 0V, non-DC-balanced mode
(Note 3)
5.7
10
Magnitude of Differential Output
Short-Circuit Current
IOSD
VOD = 0V, DC-balanced mode (Note 3)
8.2
15
mA
78
110
147
DC-balanced mode
-40°C to +105°C
78
110
150
292
410
547
Differential Output Resistance
RO
Non-DC-balanced
mode
-40°C to +105°C
292
410
564
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