3V/5V Low-Power, Low-Noise, CMOS,
Rail-to-Rail I/O Op Amps
MAX9636/MAX9637/MAX9638
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VDD, SHDN to VSS ..................................................-0.3V to +6V
IN+, IN-, OUT ....................................GND - 0.3V to VDD + 0.3V
Continuous Input Current (any pins)............................... Q20mA
Output Short Circuit to VDD or VSS Duration .......................... 5s
Thermal Limits (Note 1)
Multiple Layer PCB
Continuous Power Dissipation (TA = +70NC)
6-Pin SC70 (derate 3.1mW/°C above +70NC) ............245mW
B
JA.......................................................................326.5°C/W
B
JC .........................................................................115°C/W
8-Pin SC70 (derate 3.1mW/NC above +70NC).............245mW
B
JA .........................................................................326°C/W
B
JC .........................................................................115NC/W
10-Pin UTQFN (derate 7mW/NC above +70NC)........558.7mW
B
JA ......................................................................143.2NC/W
B
JC.........................................................................20.1NC/W
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature ....................................................+150NC
Lead Temperature (soldering 10s) .................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VCM = VDD/2, RL = 10kI to VDD/2, SHDN = VDD, TA = -40NC to +125NC. Typical values are
at TA = +25NC, unless otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Input Voltage Range
VIN+, VIN- Guaranteed by CMRR
VSS -
0.1
VDD +
0.1
V
Input Offset Voltage
VOS
TA = +25NC
0.01
2.2
mV
TA = -40NC to +125NC
3.5
Input Offset Voltage Drift
(Note 3)
TCVOS
MAX9636 only
7
F
V/NC
MAX9637, MAX9638 only
10
Input Bias Current (Note 3)
IB
TA = +25NC
±0.1
±0.8
pA
TA = -40NC to +85NC
±50
TA = -40NC to +125NC
±800
Common-Mode Rejection Ratio
CMRR
VSS < VCM <
(VDD - 1.4V)
TA = +25NC
72
86
dB
TA = -40NC to +125NC
68
(VSS - 0.1V) < VCM < (VDD + 0.1V)
58
77
Open-Loop Gain
AOL
VOUT = 0.25V from rails
104
124
dB
VOUT = 0.4V from rails, RL = 600I
100
120
Output Short-Circuit Current
ISC
Short to VDD
55
mA
Short to VSS
40
Output Voltage Low
VOL
VOUT
RL = 10kI
0.014
0.03
V
RL = 600I
0.044
0.08
Output Voltage High
VOH
VDD - VOUT
RL = 10kI
0.019
0.04
V
RL = 600I
0.057
0.1
Output Leakage in Shutdown
SHDN = VSS, VOUT = 0V to VDD (MAX9636,
MAX9638 only)
0.01
1
F
A