
MAX9691/MAX9692/MAX9693
Single/Dual, Ultra-Fast, ECL-Output
Comparators with Latch Enable
2
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ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +5V, VEE = -5.2V, RL = 50 to VT, VT = -2V, LE = 0, TA = TMIN to TMAX, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Supply Voltage (VCC) ...............................................-0.3V to +6V
Supply Voltage (VEE)................................................-6V to +0.3V
Input Voltage....................................(VCC + 0.3V) to (VEE - 0.3V)
Output Short-Circuit Duration ....................................Continuous
Differential Input Voltage ......................................................±5V
Latch Enable ...............................................(VEE - 0.3V) to +0.3V
Output Current ....................................................................50mA
Input Current ....................................................................±25mA
Continuous Power Dissipation (TA = +70°C)
8-Pin MAX (derate 4.8mW/°C above 70°C)...............387.8mW
8-Pin SO (derate 7.4mW/°C above +70°C)..................588.2mW
8-Pin PDIP (derate 9.1mW/°C above +70°C) ...........727.3mW
10-Pin MAX (derate 8.8mW/°C above +70°C) ...........707.3mW
16-Pin QSOP (derate 9.6mW/°C above +70°C) .........771.5mW
16-Pin SO (derate 13.3mW/°C above +70°C) ..........1066.7mW
16-Pin PDIP (derate 10.5mW/°C above +70°C) .......842.1mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-55°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
TA = +25
°C
-6.5
6.5
Input Offset Voltage
VOS
TA = TMIN to TMAX
-11.5
+11.5
mV
Temperature Coefficient
VOS/T
10
V/°C
TA = +25
°C
0.2
5
Input Offset Current
IOS
TA = TMIN to TMAX
8
A
TA = +25
°C6
20
Input Bias Current
IB
TA = TMIN to TMAX
30
A
Input Voltage Range
VCM
Note 1
-2.5
+3.0
V
Common-Mode Rejection Ratio
CMRR
-2.5V
≤ VCM ≤ +3.0V (Note 1)
60
80
dB
Positive Power-Supply Rejection
Ratio
+PSRR
4.5V
≤ VCC ≤ 5.5V
60
dB
Negative Power-Supply
Rejection Ratio
-PSRR
-5.7V
≤ VEE ≤ -4.7V
60
dB
Open-Loop Gain
AOL
VCM = 0V
70
dB
Differential Input Resistance
RIN
-10mV < VIN < 10mV
60
k
Differential Input Clamp Voltage
1.7
V
Input Capacitance
CIN
3pF
Latch Enable Input Current High
IIH(LE)
VIH(LE) = 1.1V
60
120
A
Latch Enable Input Current Low
IIL(LE)
VIL(LE) = 1.5V
0.2
10
A
Latch Enable Logic High VoltageVIH(LE)
-1.1
V
Latch Enable Logic Low Voltage
VIL(LE)
-1.5
V
TA = TMIN
-1.2
-0.87
TA = TMAX
-0.99
-0.70
Logic Output High Voltage
VOH
TA = +25°C
-1.06
-0.76
V
TA = TMIN
-1.93
-1.57
TA = TMAX
-1.89
-1.51
Logic Output Low Voltage
VOL
TA = +25°C
-1.89
-1.55
V