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参数资料
| 型号： | MAX9701ETG+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/22页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO PWR 2.2W D 24TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | D 类 |
| 输出类型： | 2 通道（立体声） |
| 在某负载时最大输出功率 x 通道数量： | 2.2W x 2 @ 4 欧姆 |
| 电源电压： | 2.5 V ~ 5.5 V |
| 特点： | 消除爆音，差分输入，短路和热保护，关闭 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
MAX9701
Low frequencies are summed through a two-pole low-
pass filter and sent to the MAX9700 mono speaker
amplifier. The passband gain of the lowpass filter is
unity for in-phase stereo signals,
where R1 = R2 and R3 = R1//R2. The cutoff frequency
of the lowpass filter is set by the following equation:
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Large traces also aid in moving
heat away from the package. Proper grounding improves
audio performance, minimizes crosstalk between chan-
nels, and prevents any switching noise from coupling into
the audio signal. Connect PGND and GND together at a
single point on the PC board. Route all traces that carry
switching transients away from GND and the traces/com-
ponents in the audio signal path.
Bypass VDD with 10μF to GND and PVDD with 0.1μF to
PGND. Place the bypass capacitors as close to the
MAX9701 as possible. Use large, low-resistance output
traces. Current drawn from the outputs increases as load
impedance decreases. High-output trace resistance
decreases the power delivered to the load. Large output,
supply, and GND traces allow more heat to move from
the MAX9701 to the air, decreasing the thermal imped-
ance of the circuit.
The MAX9701 thin QFN-EP package features an
exposed thermal pad on its underside. This pad lowers
the package’s thermal impedance by providing a
direct heat conduction path from the die to the printed
circuit board. Connect the exposed thermal pad to the
GND plane.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, refer to Application Note:
UCSP—A Wafer-Level Chip-Scale Package available on
Maxim’s website at www.maxim-ic.com/ucsp.
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1.3W, Filterless, Stereo Class D Audio
Power Amplifier
16
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9701EUP | 制造商:Maxim Integrated Products 功能描述:1.3W, FILTERLESS, STEREO CLASS D AUDIO POWER - Rail/Tube |
| MAX9701EUP-T | 制造商:Maxim Integrated Products 功能描述:1.3W, FILTERLESS, STEREO CLASS D AUDIO POWER - Tape and Reel |
| MAX9701EVKIT | 功能描述:音频放大器 Evaluation Kit for the MAX9701 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9702BETI+ | 制造商:Maxim Integrated Products 功能描述:AUD AMP HDPH/SPKR 2CH STEREO 1.8W/0.045W CLS-AB/CLS-D 28TQFN - Rail/Tube |
| MAX9702BETI+T | 制造商:Maxim Integrated Products 功能描述:AUD AMP HDPH/SPKR 2CH STEREO 1.8W/0.045W CLS-AB/CLS-D 28TQFN - Tape and Reel |
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