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参数资料
| 型号： | MAX9724CETC+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 6/19页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO .063W STER 12TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 系列： | DirectDrive® |
| 类型： | AB 类 |
| 输出类型： | 耳机，2-通道（立体声） |
| 在某负载时最大输出功率 x 通道数量： | 63mW x 2 @ 32 欧姆 |
| 电源电压： | 2.5 V ~ 5.5 V |
| 特点： | 消除爆音，短路保护和热保护，关闭 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 12-TQFN EP（3x3） |
| 封装/外壳： | 12-WQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 配用： | MAX9724AEVKIT+-ND - EVALUATION KIT FOR MAX9724A/B MAX9724DEVKIT+-ND - KIT EVAL FOR MAX9724D |
To suppress this noise, and to provide a 2VRMS stan-
dard audio output level from a single 5V supply, the
MAX9724C can be configured as a line driver and
active lowpass filter. Figure 5 shows the MAX9724C
connected as 2-pole Rauch/multiple feedback filter with
a passband gain of 6dB and a -3dB (below passband)
cutoff frequency of approximately 27kHz (see Figure 6
for the Gain vs. Frequency plot).
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point on the PCB. Connect PVSS to SVSS and
bypass with a 1F capacitor. Place the power-supply
bypass capacitor and the charge-pump hold capacitor
as close to the MAX9724 as possible. Route PGND and
all traces that carry switching transients away from
SGND and the audio signal path. The thin QFN pack-
age features an exposed pad that improves thermal
efficiency. Ensure that the exposed pad is electrical-
ly isolated from PGND, SGND, and VDD. Connect the
exposed paddle to SVSS only when the board lay-
out dictates that the exposed pad cannot be left
floating.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, refer to the Application Note
UCSP—A
Wafer-Level Chip-Scale Package available on Maxim’s
website at www.maxim-ic.com/ucsp.
MAX9724C/MAX9724D
Low RF Susceptibility DirectDrive Stereo Head-
phone Amplifier with 1.8V Compatible Shutdown
14
______________________________________________________________________________________
MAX9724C ACTIVE FILTER GAIN
vs. FREQUENCY
FREQUENCY (Hz)
GAIN
(dB)
100k
10k
-30
-25
-20
-15
-10
-5
0
5
10
-35
1k
1M
RL = 10k
Ω
Figure 6. Frequency Response of Active Filter of Figure 4
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| MAX9724DETC+T | IC AMP AUDIO .063W STER 12TQFN |
| LTC2436-1IGN#PBF | IC CONV A/D 16B 2CH DIFF 16SSOP |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9724CEVKIT+ | 制造商:Maxim Integrated Products 功能描述:LOW RF SUSCEPTIBILITY DIRECTDRIVE S - Boxed Product (Development Kits) |
| MAX9724DEBC+T | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX9724DEBC+TG45 | 功能描述:音频放大器 Low RF Susceptible Headphone Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9724DETC+ | 功能描述:音频放大器 Low RF Susceptible Headphone Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9724DETC+T | 功能描述:音频放大器 Low RF Susceptible Headphone Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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