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| 型号： | MAX9730ETI+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/12页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO PWR 2.4W G 28TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 75 |
| 类型： | G 类 |
| 输出类型： | 1-通道（单声道） |
| 在某负载时最大输出功率 x 通道数量： | 2.4W x 1 @ 8 欧姆 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 特点： | 消除爆音，差分输入，关闭 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 28-TQFN-EP（5x5） |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 包装： | 管件 |
| 产品目录页面： | 1424 (CN2011-ZH PDF) |
MAX9730
Thermal Considerations
Class G amplifiers provide much better efficiency and
thermal performance than a comparable Class AB
amplifier. However, the system’s thermal performance
must be considered with realistic expectations and
include consideration of many parameters. This section
examines Class G amplifiers using general examples to
illustrate good design practices.
TQFN Considerations
The exposed pad is the primary route of keeping heat
away from the IC. With a bottom-side exposed pad, the
PCB and its copper become the primary heatsink for
the Class G amplifier. Solder the exposed pad to a
large copper polygon that is connected to the ground
plane.
The copper polygon to which the exposed pad is
attached should have multiple vias to the opposite side
of the PCB, where they connect to GND. Make this
polygon as large as possible within the system’s con-
straints.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, go to the Maxim website at www.maxim-
ic.com/ucsp for the application note,
UCSP—A Wafer-
Level Chip-Scale Package.
2.4W, Single-Supply, Class G Power Amplifier
10
______________________________________________________________________________________
Typical Application Circuit/Functional Diagram
MAX9730
+
IN+
FB+
1 (B2)
0.1
μF
4 (A3)
14, 22
(D1, D5)
RIN-
10k
Ω
VCC
RIN-
10k
Ω
CIN
1
μF
CIN
1
μF
IN-
20 (D2)
16 (D4)
FB-
OUT+
13 (C5)
( ) WLP PACKAGE
DEVICE SHOWN WITH AV = 12dB
*SYSTEM-LEVEL REQUIREMENT TYPICALLY 10
μF
FS
OUT-
10 (B5)
7 (A4)
9 (A5)
12 (B4)
18 (D3)
27 (A1)
26 (B1)
3 (A2) 24 (C1)
15, 21
(C2, C4)
-
CLASS G
OUTPUT
STAGE
CHARGE
PUMP
RFB+
10k
Ω
RFB-
10k
Ω
SHDN
CPGND
PVSS
SVSS
C1N
C1P
C2
10
μF
RFS
100k
Ω
GND
CPVDD
C1
4.7
μF
VDD
*
SHDN
CONTROL
SIGNAL
20k
Ω
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9730ETI+ | 功能描述:音频放大器 2.4W Class G Power Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9730ETI+T | 功能描述:音频放大器 2.4W Class G Power Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9730EVKIT+ | 功能描述:音频 IC 开发工具 MAX9730 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Evaluation Kits 类型:Audio Amplifiers 工具用于评估:TAS5614L 工作电源电压:12 V to 38 V |
| MAX9730EWP+TG45 | 功能描述:音频放大器 2.4W Class G Power Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9736AETJ/V+ | 功能描述:音频放大器 Mono/Stereo Class D Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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