参数资料
型号: MAX9744ETH+T
厂商: Maxim Integrated Products
文件页数: 16/28页
文件大小: 0K
描述: IC AMP AUDIO PWR 22.5W D 44TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
类型: D 类
输出类型: 2 通道(立体声)
在某负载时最大输出功率 x 通道数量: 22.5W x 2 @ 4 欧姆
电源电压: 4.5 V ~ 14 V
特点: 消除爆音,静音,短路和热保护,关机,音量控制
安装类型: 表面贴装
供应商设备封装: 44-TQFN-EP(7x7)
封装/外壳: 44-WFQFN 裸露焊盘
包装: 标准包装
其它名称: MAX9744ETH+TDKR
MAX9744
Supply Bypassing, Layout,
and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance. Large traces also aid in mov-
ing heat away from the package. Proper grounding
improves audio performance, minimizes crosstalk
between channels, and prevents any switching noise
from coupling into the audio signal. Connect PGND and
GND together at a single point on the PCB. Route all
traces that carry switching transients away from GND
and the traces/components in the audio signal path.
Connect all PVDD power supplies together and bypass
with a 1F capacitor to PGND. Connect all VDD power
supplies together and bypass with a 1F capacitor to
GND. Place a bulk capacitor between PVDD and PGND
if needed.
Use large, low-resistance output traces. Current drawn
from the outputs increase as load impedance decreas-
es. High output trace resistance decreases the power
delivered to the load. Large output, supply, and GND
traces allow more heat to move from the MAX9744 to
the air, decreasing the thermal impedance of the circuit.
The MAX9744 thin QFN package features an exposed
thermal pad on its underside. This pad lowers the pack-
age’s thermal resistance by providing a direct heat con-
duction path from the die to the PCB. Connect the
exposed thermal pad to PGND by using a large pad and
multiple vias to the PGND plane. The exposed pad must
be connected to PGND for proper device operation.
20W Stereo Class D Speaker Amplifier
with Volume Control
______________________________________________________________________________________
23
TOP VIEW
MAX9744
TQFN
(7mm x 7mm)
12
13
14
15
16
17
18
19
20
21
22
GND
ADDR1
ADDR2
GND
INL
FBL
FBR
INR
BIAS
VDD
SHDN
44
43
42
41
40
39
+
38
37
36
35
34
1
2
34
5
67
89
10
11
PGND
OUTL-
BOOTL-
PGND
BOOTR-
OUTR-
PGND
GND
V
DD
SCLK/PWM
SDA/VOL
GND
V
DD
PVDD
OUTL+
BOOTL+
33
32
31
30
29
28
27
26
25
24
23
N.C.
MUTE
SYNC
SYNCOUT
GND
V
DD
PVDD
OUTR+
BOOTR+
Pin Configuration
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相关代理商/技术参数
参数描述
MAX9744EVCMAXQU+ 功能描述:音频放大器 Evaluation Kit/Evaluation System for the MAX9744 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
MAX9744EVKIT+ 功能描述:音频放大器 Evaluation Kit/Evaluation System for the MAX9744 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel
MAX974CPE 功能描述:校验器 IC RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压(最大值):6 mV 电源电流(最大值):1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel
MAX974CPE+ 功能描述:校验器 IC Dual Comparator / Reference RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压(最大值):6 mV 电源电流(最大值):1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel
MAX974CSE 功能描述:校验器 IC RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压(最大值):6 mV 电源电流(最大值):1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel