
MAX9788
14VP-P, Class G Ceramic Speaker Driver
2
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ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = VCPVDD = VSHDN = 3.6V, VGND = VCPGND = 0V, RIN+ = RIN- = 10k
Ω, RFB+ = RFB- = 10kΩ, RFS = 100kΩ, C1 = 4.7F, C2 =
10F; load connected between OUT+ and OUT-, ZLOAD = 10
Ω + 1F, unless otherwise stated; TA = TMIN to TMAX, unless otherwise
noted. Typical values are at TA = +25°C.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages with respect to GND.)
VCC, CPVDD .............................................................-0.3V to +6V
PVSS, SVSS ...............................................................-6V to +0.3V
CPGND..................................................................-0.3V to +0.3V
OUT+, OUT-...................................(SVSS - 0.3V) to (VCC + 0.3V)
IN+, IN-, FB+, FB- ......................................-0.3V to (VCC + 0.3V)
C1N .........................................(PVSS - 0.3V) to (CPGND + 0.3V)
C1P ......................................(CPGND - 0.3V) to (CPVDD + 0.3V)
FS, SHDN ...................................................-0.3V to (VCC + 0.3V)
Continuous Current Into/Out of
OUT+, OUT-, VCC, GND, SVSS .....................................800mA
CPVDD, CPGND, C1P, C1N, PVSS.................................800mA
Any Other Pin ..................................................................20mA
Continuous Power Dissipation (TA = +70°C)
20-Bump WLP (derate 10.3mW/°C
above +70°C) (Note 1)..................................................827mW
28-Pin TQFN (derate 20.8mW/°C above +70°C) ........1667mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
Bump Temperature (soldering) Reflow............................+235°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Supply Voltage Range
VCC
Inferred from PSRR test
2.7
5.5
V
Quiescent Current
ICC
812
mA
Shutdown Current
ISHDN
SHDN = GND
0.3
5
A
Turn-On Time
tON
Time from shutdown or power-on to full
operation
50
ms
Input DC Bias Voltage
VBIAS
IN_ inputs (Note 4)
1.1
1.24
1.4
V
ILOAD = 0mA (slow mode)
55
83
110
Charge-Pump Oscillator
Frequency
fOSC
ILOAD > 100mA (normal mode)
230
330
470
kHz
VIH
1.4
SHDN Input Threshold
(Note 5)
VIL
0.4
V
SHDN Input Leakage Current
±1
A
SPEAKER AMPLIFIER
TA = +25°C
±3
±15
Output Offset Voltage
VOS
TMIN
≤ TA ≤ TMAX
±20
mV
Click-and-Pop Level
VCP
Peak voltage into/out of shutdown
A-weighted, 32 samples per second
(Notes 6, 7)
-67
dBV
Voltage Gain
AV
(Notes 4, 8)
11.5
12
12.5
dB
VCC = 5V
7.1
VCC = 4.2V
5.9
VCC = 3.6V
5.1
Output Voltage
VOUT
f = 1kHz, 1% THD+N
VCC = 3.0V
4.2
VRMS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-