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| 型号： | MAX9791CETI+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 19/34页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO 2.2W STER D 28WQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 75 |
| 系列： | DirectDrive® |
| 类型： | D 类 |
| 输出类型： | 2-通道（立体声）带立体声耳机和超低音器 |
| 在某负载时最大输出功率 x 通道数量： | 2.2W x 2 @ 4 欧姆; 180mW x 2 @ 32 欧姆 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 特点： | 消除爆音，LDO，短路保护和热保护，关机 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 28-TQFN-EP（4x4） |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 包装： | 管件 |
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MAX9791/MAX9792
Windows Vista-Compliant Class D Speaker
Amplifiers with DirectDrive Headphone Amplifiers
26
______________________________________________________________________________________
Charge-Pump Output Capacitor (C2)
Connect a 1F capacitor between CPVSS and PGND.
LDO Output Capacitor (CLDO)
Connect 2 x 1F capacitors between LDO_OUT and
GND for 4.75V and 3.3V LDO options (MAX979_A and
MAX979_B, respectively). Connect two parallel 2F
capacitors between LDO_OUT and GND for the 1.8V
LDO option (MAX979_C).
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance, as well as route heat away
from the device. Good grounding improves audio per-
formance, minimizes crosstalk between channels, and
prevents switching noise from coupling into the audio
signal. Connect PGND and GND together at a single
point on the PCB. Route PGND and all traces that carry
switching transients away from GND, and the traces
and components in the audio signal path.
Connect C2 to the PGND plane. Place the charge-
pump capacitors (C1, C2) as close as possible to the
device. Bypass PVDD with a 0.1F capacitor to PGND.
Place the bypass capacitors as close as possible to the
device.
The MAX9791/MAX9792 is inherently designed for
excellent RF immunity. For best performance, add
ground fills around all signal traces on top or bottom
PCB planes.
Use large, low-resistance output traces. As load imped-
ance decreases, the current drawn from the device out-
puts increase. At higher current, the resistance of the
output traces decrease the power delivered to the load.
For example, if 2W is delivered from the speaker output
to a 4
load through a 100m trace, 49mW is wasted
in the trace. If power is delivered through a 10m
trace, only 5mW is wasted in the trace. Large output,
supply, and GND traces also improve the power dissi-
pation of the device.
The MAX9791/MAX9792 thin QFN package features an
exposed thermal pad on its underside. This pad lowers
the package’s thermal resistance by providing a direct
heat conduction path from the die to the printed circuit
board. Connect the exposed thermal pad to GND by
using a large pad and multiple vias to the GND plane.
Chip Information
PROCESS: BiCMOS
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9791CETI+ | 功能描述:音频放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9791CETI+T | 功能描述:音频放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9792AETI+ | 功能描述:音频放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9792AETI+T | 功能描述:音频放大器 Windows Vista Class D Speaker Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX9792AEVKIT+ | 功能描述:音频放大器 Windows Vista-Compliant Class D Speaker Amplifiers with DirectDrive Headphone Amplifiers RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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