参数资料
型号: MAX9820ETB+T
厂商: Maxim Integrated Products
文件页数: 6/13页
文件大小: 0K
描述: IC AMP AUD HDPHE 95MW 10TDFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
系列: DirectDrive®
类型: AB 类
输出类型: 耳机,2-通道(立体声)
在某负载时最大输出功率 x 通道数量: 95mW x 2 @ 32 欧姆
电源电压: 2.7 V ~ 5.5 V
特点: 消除爆音,短路保护和热保护,关闭
安装类型: 表面贴装
供应商设备封装: 10-TDFN-EP(3x3)
封装/外壳: 10-WFDFN 裸露焊盘
包装: 标准包装
产品目录页面: 1392 (CN2011-ZH PDF)
其它名称: MAX9820ETB+TDKR
MAX9820
DirectDrive Headphone Amplifier
with External Gain
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = VSHDN = 5V, VGND = 0V, RIN = RFB = 40.2k (gain = -1V/V), C1 = C2 = 1F, C3 = 10F, RLOAD =
∞, TA = -40°C to +85°C,
unless otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
C1P to GND................................................-0.3V to (VDD + 0.3V)
C1N to GND ................................................(VSS - 0.3V) to +0.3V
VSS to GND...............................................................-6V to +0.3V
OUTR, OUTL to GND.............................................................±3V
SHDN to GND...........................................................-0.3V to +6V
INR, INL to GND .........................................-0.3V to (VDD + 0.3V)
OUTR, OUTL Short Circuit to GND, VDD....................Continuous
Short Circuit Between OUTL and OUTR ....................Continuous
Continuous Input Current (Into All Other Pins) .................±20mA
Continuous Power Dissipation (TA = +70°C)
10-Pin TDFN Single-Layer PCB (derate 18.5mW/°C
above +70°C)........................................................1481.5mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
10-Pin TDFN ................................................................8.5°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
10-Pin TDFN ...............................................................41.0°C/W
Continuous Power Dissipation (TA = +70°C)
10-Pin TDFN Multilayer PCB (derate 24.4mW/°C
above +70°C)...........................................................1951mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
10-Pin TDFN .................................................................9.0°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
10-Pin TDFN ...............................................................41.0°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Supply Voltage Range
VDD
Guaranteed by PSRR test
2.7
5.5
V
Undervoltage Lockout
UVLO
2.2
V
VDD = 3.3V
3.0
4.6
Quiescent Current
IDD
VDD = 5V
4.0
6.0
mA
Shutdown Current
ISHDN
VSHDN = 0V, TA = +25°C
< 0.1
1
A
Output Signal Attenuation in
Shutdown
VSHDN = 0V, VIN = 1VRMS, RLOAD = 10k
-110
dBV
Output Impedance in
Shutdown
VSHDN = 0V
0.6
k
Turn-On Time
tON
0.56
ms
Output Offset Voltage
VOS
TA = +25°C (Note 3)
±0.1
±0.5
mV
Into shutdown
-79
ZLOAD = 32
+ 1H, peak
voltage, A-weighted, 32 samples
per second (Notes 3, 4)
Out of
shutdown
-77
Into shutdown
-62
Click-and-Pop Level
KCP
ZLOAD = 10k
, peak voltage,
A-weighted, 32 samples per
second (Notes 3, 4)
Out of
shutdown
-58
dBV
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
相关PDF资料
PDF描述
MAX98300SETA+T IC AMP AUD SPKR 2W MONO D 8TDFN
MAX98302ETD+ IC AMP STER CLASS D 2.4W 14TDFN
MAX98303EWE+T IC AMP AUDIO 3.1W STEREO D 16WLP
MAX98304EWL+T IC AMP AUDIO 3.2W MONO D 9WLP
MAX98306ETD+T IC AMP AUDIO 3.7W STER D 14TDFN
相关代理商/技术参数
参数描述
MAX9820EVKIT+ 功能描述:音频 IC 开发工具 MAX9820 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Evaluation Kits 类型:Audio Amplifiers 工具用于评估:TAS5614L 工作电源电压:12 V to 38 V
MAX982CPA 功能描述:校验器 IC Dual Comparator / Reference RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压(最大值):6 mV 电源电流(最大值):1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel
MAX982CPA+ 功能描述:校验器 IC Dual Comparator / Reference RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压(最大值):6 mV 电源电流(最大值):1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel
MAX982CSA 功能描述:校验器 IC Dual Comparator / Reference RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压(最大值):6 mV 电源电流(最大值):1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel
MAX982CSA+ 功能描述:校验器 IC Dual Comparator / Reference RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压(最大值):6 mV 电源电流(最大值):1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel