
2 ______________________________________________________________________________________
MAX98303
Stereo 3.1W Class D Amplifier
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PVDD to PGND........................................................-0.3V to +6V
OUT_+, OUT_- to PGND .......................-0.3V to (VPVDD + 0.3V)
All Other Pins to PGND ...........................................-0.3V to +6V
Continuous Current for PVDD, PGND,
OUTL_, OUTR_ ........................................................ Q1600mA
Continuous Input Current (all other pins)........................ Q20mA
Duration of Short Circuit Between
OUTL_, OUTR_ to PVDD or PGND ........................Continuous
OUTL+ to OUTL-, OUTR+ to OUTR- ....................Continuous
Continuous Power Dissipation for Multilayer Board (TA = +70NC)
16-Bump WLP (derate 17.2mW/NC above +70NC) ........1.38W
B
JA (Note 1)..................................................................58NC/W
B
JC (Note 1) .................................................................15NC/W
Junction Temperature .....................................................+150NC
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VPVDD = VSHDN = 3.7V, VPGND = 0V, AV = 12dB (GAIN = PVDD), RL = J, RL connected between OUT_+ to OUT_-, 20Hz to 22kHz
AC measurement bandwidth, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage Range
VPVDD
Inferred from PSRR test
2.6
5.5
V
Undervoltage Lockout
UVLO
2.3
V
Quiescent Supply Current
IDD
2.0
3.1
mA
VPVDD = 5.0V
2.7
Shutdown Supply Current
ISHDN
VSHDN = 0V, TA = +25NC
≤ 0.1
10
F
A
Turn-On Time
tON
3.4
10
ms
Bias Voltage
VBIAS
1.3
V
Voltage Gain
AV
Connect GAIN to PGND
17.5
18
18.5
dB
Connect GAIN to PGND through 100kI
±5% resistor
14.5
15
15.5
Connect GAIN to PVDD
11.5
12
12.5
Connect GAIN to PVDD through 100kI
±5% resistor
8.5
9
9.5
GAIN unconnected
5.5
6
6.5
Channel-to-Channel Gain
Tracking
±0.1
%
Input Resistance
RIN
AV = 18dB
15
20
29
kI
AV = 15dB
15
20
29
AV = 12dB
15
20
29
AV = 9dB
20
28
40
AV = 6dB
30
40
58
Output Offset Voltage
VOS
TA = +25NC (Note 4)
±0.3
±3
mV