2 ______________________________________________________________________________________
MAX98306
Stereo 3.7W Class D Amplifier
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Voltage
PVDD to PGND....................................................-0.3V to +6V
OUTL+, OUTR+, OUTL-, OUTR-
to PGND...........................................-0.3V to (VPVDD + 0.3V)
All Other Pins to PGND .......................................-0.3V to +6V
Current
Continuous Current Into/Out of PVDD, PGND,
OUTL+, OUTR+, OUTL-, OUTR- .............................. ±800mA
Continuous Input Current (all other pins).................... ±20mA
Duration of Short Circuit
OUTL+, OUTR+, OUTL-, OUTR- to PGND or PVDD....Continuous
OUTL+ to OUTL- or OUTR+ to OUTR-...................Continuous
Continuous Power Dissipation for a MultiLayer Board (TA = +70°C)
TDFN (deration 24.4mW/°C above +70°C) ...............1951.2mW
Junction Temperature ....................................................+150°C
Operating Temperature Range ......................... -40°C to +85°C
Storage Temperature Range .......................... -65°C to +150°C
Lead Temperature (10s, soldering) ...............................+300°C
Soldering Temperature (reflow) ......................................+260°C
ELECTRICAL CHARACTERISTICS
(VPVDD = VSHDN = 3.7V, VPGND = 0V, AV = 12dB (GAIN = PVDD), RL = J, RL connected between OUT_+ to OUT_-, 20Hz to 22kHz
AC measurement bandwidth, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Junction-to-Ambient Thermal Resistance (
qJA) ..............41°C/W
Junction-to-Case Thermal Resistance (
qJA) .....................8°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Supply Voltage Range
VPVDD
Guaranteed by PSRR test
2.6
5.5
V
Undervoltage Lockout
UVLO
1.8
2.3
V
Quiescent Supply Current
IPVDD
VPVDD = 3.7V
2
2.7
mA
VPVDD = 5.0V
2.6
Shutdown Supply Current
ISHDN
VSHDN = 0, TA = +25NC
< 1
10
F
A
Turn On Time
tON
3.2
10
ms
Bias Voltage
VBIAS
1.62
VPVDD/2
2.15
V
Voltage Gain
AV
GAIN = PGND
17.5
18
18.5
dB
GAIN = 100kI to PGND
14.5
15
15.5
GAIN = PVDD
11.5
12
12.5
GAIN = 100kI to PVDD
8.5
9
9.5
GAIN = unconnected
5.5
6
6.5
Channel-to-Channel Gain
Tracking
0.1
%
Input Resistance
RIN
AV = 18dB (GAIN = PGND)
22
33
kI
AV = 15Db (GAIN = 100kI to PGND)
31
46
AV = 12dB (GAIN = PVDD)
44
65
AV = 9dB (GAIN = 100kI to PVDD)
62
93
AV = 6dB (GAIN = unconnected)
89
131
Common-Mode Rejection Ratio
CMRR
fIN = 1kHz, input referred
79
dB
Output Offset Voltage
VOS
TA = +25NC (Note 3)
±1
±3
mV