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参数资料
| 型号： | MAX9919NASA+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 11/18页 |
| 文件大小： | 0K |
| 描述： | IC AMP CURRENT SENSE 8SOIC |
| 标准包装： | 2,500 |
| 放大器类型： | 电流检测 |
| 电路数： | 1 |
| 输出类型： | 满摆幅 |
| 转换速率： | 3 V/µs |
| -3db带宽： | 120kHz |
| 电流 - 输入偏压： | 175µA |
| 电压 - 输入偏移： | 400µV |
| 电流 - 电源： | 1mA |
| 电压 - 电源，单路/双路(±)： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 供应商设备封装： | 8-SOICN 裸露焊盘 |
| 包装： | 带卷 (TR) |
MAX9918/MAX9919/MAX9920
-20V to +75V Input Range, Precision
Uni-/Bidirectional, Current-Sense Amplifiers
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = 5V, VRS+ = VRS- = +14V, VSENSE = (VRS+ - VRS-) = 0V, VSHDN = VGND = 0V, VREFIN = VCC/2, RL = 100kΩ; for MAX9918, AV =
90V/V, R2/R1 = 89k
Ω/1kΩ; for MAX9920, AV = 20V/V, R2/R1 = 79kΩ/1kΩ; TA = -40°C to +125°C, unless otherwise noted. Typical val-
ues are at TA = +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to GND ..............................................................-0.3V to +6V
RS+, RS- to GND (VCC = 5V) ..................................-30V to +80V
RS+, RS- to GND (VCC = 0V) .............-15V to +80V (15 minutes)
Differential Input Voltage (VRS+ - VRS-)
(MAX9918/MAX9919).................................±15V (Continuous)
Differential Input Voltage
(VRS+ - VRS-) (MAX9920) .............................±5V (Continuous)
REFIN, FB, OUT to GND.............................-0.3V to (VCC + 0.3V)
SHDN to GND.........................................................-0.3V to +20V
Output Short Circuit to VCC or GND...........................Continuous
Continuous Current into Any Pin
(Not to exceed package power dissipation) ................±20mA
Continuous Power Dissipation (TA = +70°C)
8-Pin SO-EP (derate 24.4mW/°C above +70°C).....1951.2mW**
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SO-EP
Junction-to-Ambient Thermal Resistance (
θJA) ...........41°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
TA = +25°C
±0.14
±0.4
VRS+ = VRS- =
+14V, VREFIN
= 0V
TA = -40°C
to +125°C
±0.7
TA = +25°C
±0.08
±0.4
MAX9918
VRS+ = VRS- =
-2V, VREFIN =
0V
TA = -40°C
to +125°C
±1.3
TA = +25°C
±0.18
±0.4
VRS+ = VRS- =
+14V, VREFIN
= 0V
TA = -40°C
to +125°C
±0.9
TA = +25°C
±0.11
±0.4
MAX9919_
VRS+ = VRS- =
-2V, VREFIN =
0V
TA = -40°C
to +125°C
±1.0
TA = +25°C
±0.48
±1.2
VRS+ = VRS- =
+14V, VREFIN
= 0V
TA = -40°C
to +125°C
±3.0
TA = +25°C
±0.10
±0.9
Input Offset Voltage (Note 2)
VOS
MAX9920
VRS+ = VRS- =
-2V, VREFIN =
0V
TA = -40°C
to +125°C
±3.5
mV
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
**
As per JEDEC51 Standard (multilayer board).
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