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参数资料
| 型号： | MAX9926UAEE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/23页 |
| 文件大小： | 0K |
| 描述： | IC SENSOR INTERFACE VARI 16-QSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 传感器接口 |
| 输入类型： | 差分 |
| 输出类型： | 逻辑 |
| 接口： | 差分 |
| 电流 - 电源： | 10mA |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-QSOP |
| 包装： | 带卷 (TR) |
MAX9924–MAX9927
Variable Reluctance Sensor Interfaces with
Differential Input and Adaptive Peak Threshold
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = 5V, VGND = 0V, MAX9925/MAX9927 gain setting = 1V/V, Mode A1, VBIAS = 2.5V, VPULLUP = 5V, RPULLUP = 1kΩ, CCOUT =
50pF. TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to GND .............................................................-0.3V to + 6V
All Other Pins..............................................-0.3V to (VCC + 0.3V)
Current into IN+, IN-, IN_+, IN_-.......................................±40mA
Current into All Other Pins ................................................±20mA
Output Short-Circuit (OUT_, OUT) to GND.............................10s
Continuous Power Dissipation (TA = +70°C) (Note 1)
10-Pin MAX (derate 8.8mW/°C above +70°C) ........707.3mW
16-Pin QSOP (derate 9.6mW/°C above +70°C)........771.5mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Operating Supply Range
VCC
(Note 3)
4.5
5.5
V
MAX9924/MAX9925
2.6
5
Supply Current
ICC
MAX9926/MAX9927
4.7
10
mA
Power-On Time
PON
VCC > VUVLO = 4.1V, step time for VCC
~ 1s
30
150
s
INPUT OPERATIONAL AMPLIFIER (MAX9925/MAX9927)
Input Voltage Range
IN+, IN-
Guaranteed by CMRR
0
VCC
V
Temperature drift
5
V/
°C
Input Offset Voltage
VOS-OA
0.5
3
mV
Input Bias Current
IBIAS
(Note 4)
0.1
6
nA
Input Offset Current
IOFFSET
(Note 4)
0.05
2
nA
Common-Mode Rejection Ratio
CMRR
From VCM = 0 to VCC
75
102
dB
MAX9925
88
105
Power-Supply Rejection Ratio
PSRR
MAX9927
77
94
dB
Output Voltage Low
VOL
IOL = 1mA
0.050
V
Output Voltage High
VOH
IOH = -1mA
VCC -
0.050
V
Recovery Time from Saturation
tSAT
To 1% of the actual VOUT after output
saturates
1.2
s
Gain-Bandwidth Product
GBW
1.4
MHz
Slew Rate
SR
2.3
V/s
Charge-Pump Frequency
fCP
1.3
MHz
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
MAX
Junction-to-Ambient Thermal Resistance (
θJA) ......113.1°C/W
Junction-to-Case Thermal Resistance (
θJC) ................42°C/W
QSOP
Junction-to-Ambient Thermal Resistance (
θJA) ......103.7°C/W
Junction-to-Case Thermal Resistance (
θJC) ................37°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
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