参数资料
型号: MAX9995ETX+T
厂商: Maxim Integrated
文件页数: 11/13页
文件大小: 0K
描述: IC MIXER DOWN CONV 36-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
系列: MAX9995
RF 型: 手机,DCS,EDGE,PCS,UMTS,WLL
频率: 1.7GHz ~ 2.2GHz
混频器数目: 2
增益: 6.1dB
噪音数据: 9.9dB
次要属性: 降频变频器
电流 - 电源: 380mA
电源电压: 4.75 V ~ 5.25 V
包装: 带卷 (TR)
封装/外壳: 36-WFQFN 裸露焊盘
供应商设备封装: 36-TQFN 裸露焊盘(6x6)
MAX9995
Dual, SiGe, High-Linearity, 1700MHz to 2700MHz
Downconversion Mixer with LO Buffer/Switch
INDEXTM and INDEXTD Inductors
Short INDEXTM and INDEXTD to ground using 0 Ω
resistors. For applications requiring improved RF-to-IF
Table 1. Component Values
COMPONENT VALUE DESCRIPTION
and LO-to-IF isolation, use 10nH inductors (L3 and L6)
in place of the 0 Ω resistors. However, to ensure stable
operation, the mixer IF ports must be presented with
low common-mode load impedance. Contact the facto-
ry for details. Since approximately 100mA flows through
INDEXTM and INDEXTD, it is important to use low-DCR
wire-wound inductors.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground pin traces
directly to the exposed pad under the package. The
PCB exposed pad MUST be connected to the ground
plane of the PCB. It is suggested that multiple vias be
used to connect this pad to the lower-level ground
planes. This method provides a good RF/thermal-con-
duction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX9995 evaluation kit can be used as a reference for
C1, C8
C2, C7
C3, C6
C4, C5, C14, C16
C9, C13, C15,
C17, C18
C10, C11, C12,
C19, C20, C21
L1, L2, L4, L5
L3, L6
R1, R4
R2, R5
R3, R6
T1, T2
4pF
10pF
0.033μF
22pF
0.01μF
150pF
330nH
10nH
1.21k Ω
392 Ω
10 Ω
4:1
(200:50)
Microwave capacitors (0402)
Microwave capacitors (0402)
Microwave capacitors (0603)
Microwave capacitors (0402)
Microwave capacitors (0402)
Microwave capacitors (0603)
Wire-wound high-Q inductors
(0805)
Wire-wound high-Q inductors
(0603)
± 1% resistors (0402)
± 1% resistors (0402)
± 1% resistors (1206)
IF baluns
board layout. Gerber files are available upon request at
www.maximintegrated.com .
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin with a
PROCESS: SiGe BiCMOS
Chip Information
capacitor as close as possible to the pin ( Typical
Application Circuit).
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX9995’s 36-pin TQFN-
EP package provides a low thermal-resistance path to
the die. It is important that the PCB on which the
MAX9995 is mounted be designed to conduct heat
from the EP. In addition, provide the EP with a low-
inductance path to electrical ground. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes.
Lead-Free/RoHS Considerations
http://www.maximintegrated.com/emmi/faq.cfm
Reliability Information:
http://www.maximintegrated.com/reliability/product/
MAX9995.pdf
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages . Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
Maxim Integrated
PACKAGE
TYPE
36 TQFN-EP
PACKAGE
CODE
T3666+2
OUTLINE
NO.
21-0141
LAND
PATTERN NO.
90-0049
11
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