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参数资料
| 型号： | MB89PV930ACFV |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 8-BIT, 10 MHz, MICROCONTROLLER, CQFP48 |
| 封装： | CERAMIC, MQFP-48 |
| 文件页数： | 33/44页 |
| 文件大小： | 1150K |
| 代理商： | MB89PV930ACFV |
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MB89930B Series
DS07-12541-7E
39
■ PACKAGE DIMENSIONS
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
30-pin plastic SSOP
Lead pitch
0.65 mm
Package width
×
package length
5.60
× 9.70 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.45 mm MAX
Code
(Reference)
P-SSOP30-5.6
×9.7-0.65
30-pin plastic SSOP
(FPT-30P-M02)
C
2003 FUJITSU LIMITED F30003S-c-3-4
9.70±0.10(.382±.004)
5.60±0.10
7.60±0.20
(.220±.004)
(.299±.008)
"A"
(.007±.001)
0.17±0.03
.009 –.003
+.003
–
0.07
+0.08
0.24
INDEX
*1
*2
0.25(.010)
0.10±0.10
(.004±.004)
(Stand off)
Details of "A" part
(Mounting height)
1.25
+0.20
–0.10
–.004
+.008
.049
0~8
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.10(.004)
1
15
3016
0.65(.026)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
2003-2008 FUJITSU MICROELECTRONICS LIMITED F30003S-c-3-5
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3)Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
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