参数资料
型号: MB91F318RPMC-G-XXXE1
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 40.8 MHz, RISC MICROCONTROLLER, PQFP176
封装: 24 X 24 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-176
文件页数: 11/71页
文件大小: 575K
代理商: MB91F318RPMC-G-XXXE1
MB91319R Series
19
■ HANDLING DEVICES
Preventing a Latch-up
A latch-up can occur on a CMOS IC under following conditions. A latch-up, if it occurs, significantly increases
the power supply current and may cause thermal destruction of an element. When you use a CMOS IC, be very
careful not to exceed the maximum rating.
- When a voltage higher than VDDE or VDDI or a voltage lower than VSS is applied to an input or output pin.
- When a voltage higher than the rating is applied between VDDE or VDDI and VSS.
Handling of Unused Input Pins
Do not leave an unused input pin open since it may cause a malfunction. Handle by, for example, using a pull-
up or pull-down resistor.
Power Supply Pins
If more than one VDDE or VDDI or VSS pin exists, those that must be kept at the same potential are designed
to be connected to one other inside the device to prevent malfunctions such as latch-up. Be sure to connect the
pins to a power supply and ground external to the device to minimize undesired electromagnetic radiation,
prevent strobe signal malfunctions due to an increase in ground level, and conform to the total output current
rating. Given consideration to connecting the current supply source to VDDE or VDDI and VSS pin of the device
at the lowest impedance possible.
It is also recommended that a ceramic capacitor of around 0.1
F be connected between VDDE or VDDI and
VSS pin at circuit points close to the device as a bypass capacitor.
Crystal Oscillation Circuit
Noise near the X0 or X1 pin may cause the device to malfunction. Design printed circuit boards so that X0, X1,
the quartz oscillator (or ceramic oscillator), and the bypass capacitor to ground are located as near to one another
as possible.
It is strongly recommended that printed circuit board artwork that surrounds the X0 and X1 pins with ground be
used to increase the expectation of stable operation.
Please ask the Oscillation maker to evaluate the oscillational characteristics of the crystal and this device.
Mode Pins (MD0 to MD3)
In order to prevent mistakes due to noise, and sending them into test mode, connect these pins as close to
VDDE and VSS pins, and at as low an impedance as possible.
Tool Reset Pins (TRST)
Be sure to input the same signal as the INIT when this pin is not used for the tool. The same processing is
executed for the mass product.
Power-on
Immediately after power-on, be sure to apply setting initialization reset (INIT) with INIT pin.
Also immediately after power-on, keep the INIT pin at the “L” level until the oscillator has reached the required
oscillation stabilization wait time. (For initialization by INIT from the INIT pin, the oscillation stabilization wait time
is set to the minimum value.)
Source Oscillation Input at Power-on
At power-on, be sure to input a source clock until the oscillation stabilization wait time is reached.
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MB91F318RPMC-GXXX-XXXXE1 32-BIT, FLASH, 40.8 MHz, RISC MICROCONTROLLER, PQFP176
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