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参数资料
| 型号： | MB9AF115NPMC |
| 厂商： | FUJITSU LTD |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, RISC MICROCONTROLLER, PQFP100 |
| 封装： | 14 X 14 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-100 |
| 文件页数： | 52/108页 |
| 文件大小： | 1221K |
| 代理商： | MB9AF115NPMC |
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MB9A110 Series
· Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must
take the following precautions:
·Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus
for ion generation may be needed to remove electricity.
·Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
·Eliminate static body electricity by the use of rings or bracelets connected to ground through high
resistance (on the level of 1 M
). Wearing of conductive clothing and shoes, use of conductive
floor mats and other measures to minimize shock loads is recommended.
·Ground all fixtures and instruments, or protect with anti-static measures.
·Avoid the use of styrofoam or other highly static-prone materials for storage of completed board
assemblies.
· Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described
above.
For reliable performance, do the following:
1. Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If
high humidity levels are anticipated, consider anti-humidity processing.
2. Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal
operation.
In such cases, use anti-static measures or processing to prevent discharges.
3. Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will
adversely affect the device. If you use devices in such conditions, consider ways to prevent such
exposure or to protect the devices.
4. Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation.
Users should provide shielding as appropriate.
5. Smoke, Flame
Note:
Plastic molded devices are flammable, and therefore should not be used near combustible
substances.
If devices begin to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of FUJITSU products in other special environmental conditions should
consult with FUJITSU sales representatives.
Please check the latest handling precautions at the following URL.
http://edevice.fujitsu.com/fj/handling-e.pdf
48
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r1.0
DS706-00011-0v01-E
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MB9AF116MAPMC-G-JNE2 | 制造商:Fujitsu 功能描述:Bulk |
| MB9AF116NAPMC-G-JNE2 | 制造商:Fujitsu 功能描述:Bulk |
| MB9AF132KAPMC-G-SNE2 | 制造商:Fujitsu 功能描述:Bulk |
| MB9AF132KBPMC-G-SNE2 | 功能描述:IC MCU 32BIT 128KB FLASH 48LQFP 制造商:cypress semiconductor corp 系列:FM3 MB9A130LB 包装:托盘 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:20MHz 连接性:CSIO，I2C，UART/USART 外设:LVD，POR，PWM，WDT I/O 数:37 程序存储容量:128KB（128K x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:8K x 8 电压 - 电源（Vcc/Vdd）:1.8 V ~ 5.5 V 数据转换器:A/D 6x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:48-LQFP 供应商器件封装:48-LQFP（7x7） 标准包装:250 |
| MB9AF132KBQN-G-AVE2 | 功能描述:ARM? Cortex?-M3 FM3 MB9A130LB Microcontroller IC 32-Bit 20MHz 128KB (128K x 8) FLASH 48-QFN (7x7) 制造商:cypress semiconductor corp 系列:FM3 MB9A130LB 包装:托盘 零件状态:有效 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:20MHz 连接性:CSIO，I2C，UART/USART 外设:LVD，POR，PWM，WDT I/O 数:37 程序存储容量:128KB（128K x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:8K x 8 电压 - 电源（Vcc/Vdd）:1.8 V ~ 5.5 V 数据转换器:A/D 6x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:48-VFQFN 裸露焊盘 供应商器件封装:48-QFN（7x7） 标准包装:260 |
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